Shigeto N, Yanagihara T, Hamada T, Budtz-Jørgensen E
Department of Prosthetic Dentistry, Hiroshima University, School of Dentistry, Japan.
J Prosthet Dent. 1989 Nov;62(5):512-5. doi: 10.1016/0022-3913(89)90069-3.
The corrosion properties of contact between six Ni-Cr alloys and two dental solders were evaluated. Ni-Cr alloys with low Cr content coupled with silver solder induced continuous galvanic current, whereas Ni-Cr alloys with high Cr and some Mo content coupled with silver or gold solder induced galvanic current for a short time. Six Ni-Cr alloys were divided into two groups according to the dissolution of Ni, one with low resistance and the other with high resistance. The initial equilibrium was induced between high resistance Ni-Cr alloys and both solders by less current density, which implies a smaller degree of corrosive current than that in low-resistance alloys. Corrosion was observed in the silver solder coupled with high-resistance Ni-Cr alloy, but was not found in the gold solder coupled with both alloys. In soldering Ni-Cr alloy, it is better to use a gold solder and a high-resistance Ni-Cr alloy for corrosion resistance.
评估了六种镍铬合金与两种牙科焊料之间接触的腐蚀性能。低铬含量的镍铬合金与银焊料耦合会产生持续的电流，而高铬且含一些钼的镍铬合金与银或金焊料耦合会在短时间内产生电流。六种镍铬合金根据镍的溶解情况分为两组，一组电阻低，另一组电阻高。高电阻镍铬合金与两种焊料之间通过较小的电流密度诱导出初始平衡，这意味着腐蚀电流程度比低电阻合金小。在与高电阻镍铬合金耦合的银焊料中观察到了腐蚀，但在与两种合金耦合的金焊料中未发现腐蚀。在焊接镍铬合金时，为了耐腐蚀，最好使用金焊料和高电阻镍铬合金。
