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快速加热时,受限在氮化铝纳米层之间的银铜纳米合金的结构演变。

Structural evolution of Ag-Cu nano-alloys confined between AlN nano-layers upon fast heating.

作者信息

Janczak-Rusch J, Chiodi M, Cancellieri C, Moszner F, Hauert R, Pigozzi G, Jeurgens L P H

机构信息

Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Joining and Interface Technology, Überlandstrasse 129, 8600 Dübendorf, Switzerland.

出版信息

Phys Chem Chem Phys. 2015 Nov 14;17(42):28228-38. doi: 10.1039/c5cp00782h. Epub 2015 Apr 27.

Abstract

The structural evolution of a Ag-Cu/AlN nano-multilayer (NML), as prepared by magnetron-sputtering on a α-Al2O3 substrate, was monitored during fast heating by real-time in situ XRD analysis (at the synchrotron), as well as by ex situ microstructural analysis using SEM, XPS and in-house XRD. The as-deposited NML is constituted of alternating nano-layers (thickness ≈ 10 nm) of a chemically inert AlN barrier and a eutectic Ag-Cu(40at%) nano-alloy. The nano-alloy in the as-deposited state is composed of a fcc matrix of Ag nano-grains (≈6 nm), which are supersaturated by Cu, and some smaller embedded Cu rich nano-grains (≈4 nm). Heating up to 265 °C activates segregation of Cu out of the supersaturated Ag nano-grains phase, thus initiating phase separation. At T > 265 °C, the phase-separated Cu metal partially migrates to the top NML surface, thereby relaxing thermally-accumulated compressive stresses in the confined alloy nano-layers and facilitating grain coarsening of (still confined) phase-separated nano-crystallites. Further heating and annealing up to 420 °C results in complete phase separation, forming extended Ag and Cu domains with well-defined coherent Ag/AlN interfaces. The observed outflow of Cu well below the eutectic melting point of the bulk Ag-Cu alloy might provide new pathways for designing low-temperature nano-structured brazing materials.

摘要

通过磁控溅射在α-Al₂O₃衬底上制备的Ag-Cu/AlN纳米多层膜(NML),在快速加热过程中,通过实时原位XRD分析(在同步加速器上)以及使用SEM、XPS和内部XRD进行的非原位微观结构分析来监测其结构演变。沉积态的NML由化学惰性的AlN势垒和共晶Ag-Cu(40at%)纳米合金的交替纳米层(厚度≈10nm)组成。沉积态的纳米合金由Ag纳米颗粒(≈6nm)的面心立方基体组成,其中Cu过饱和,还有一些较小的嵌入富Cu纳米颗粒(≈4nm)。加热到265℃会促使Cu从过饱和的Ag纳米颗粒相中偏析出来,从而引发相分离。在T>265℃时,相分离的Cu金属部分迁移到NML顶层表面,从而释放受限合金纳米层中热积累的压缩应力,并促进(仍受限的)相分离纳米微晶的晶粒粗化。进一步加热并退火至420℃会导致完全相分离,形成具有明确相干Ag/AlN界面的扩展Ag和Cu区域。在远低于块状Ag-Cu合金共晶熔点的温度下观察到的Cu流出可能为设计低温纳米结构钎焊材料提供新途径。

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