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基于模式演化反锥耦合器的宽带且易于制造的片上可扩展模式分割复用技术。

Broadband and fabrication-tolerant on-chip scalable mode-division multiplexing based on mode-evolution counter-tapered couplers.

作者信息

Wang Jing, Xuan Yi, Qi Minghao, Huang Haiyang, Li You, Li Ming, Chen Xin, Sheng Zhen, Wu Aimin, Li Wei, Wang Xi, Zou Shichang, Gan Fuwan

出版信息

Opt Lett. 2015 May 1;40(9):1956-9. doi: 10.1364/OL.40.001956.

DOI:10.1364/OL.40.001956
PMID:25927757
Abstract

A broadband and fabrication-tolerant on-chip scalable mode-division multiplexing (MDM) scheme based on mode-evolution counter-tapered couplers is designed and experimentally demonstrated on a silicon-on-insulator (SOI) platform. Due to the broadband advantage offered by mode evolution, the two-mode MDM link exhibits a very large, -1  dB bandwidth of >180  nm, which is considerably larger than most of the previously reported MDM links whether they are based on mode-interference or evolution. In addition, the performance metrics remain stable for large-device width deviations from the designed valued by -60  nm to 40 nm, and for temperature variations from -25°C to 75°C. This MDM scheme can be readily extended to higher-order mode multiplexing and a three-mode MDM link is measured with less than -10  dB crosstalk from 1.46 to 1.64 μm wavelength range.

摘要

基于模式演化反锥形耦合器,设计了一种宽带且易于制造的片上可扩展模式分割复用(MDM)方案,并在绝缘体上硅(SOI)平台上进行了实验验证。由于模式演化带来的宽带优势,双模MDM链路展现出大于180 nm的非常大的-1 dB带宽,这比大多数先前报道的MDM链路都要大得多,无论它们是基于模式干涉还是模式演化。此外,对于器件宽度相对于设计值有-60 nm至40 nm的较大偏差,以及温度在-25°C至75°C范围内变化时,性能指标仍保持稳定。这种MDM方案可以很容易地扩展到高阶模式复用,并且在1.46至1.64μm波长范围内测量到的三模MDM链路的串扰小于-10 dB。

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