Shin Chonghoon, Park Jinjoo, Kim Sangho, Park Hyeongsik, Jung Junhee, Bong Sungjae, Lee Youn-Jung, Yi Junsin
J Nanosci Nanotechnol. 2014 Dec;14(12):9388-94. doi: 10.1166/jnn.2014.10122.
Highly conducting boron-doped microcrystalline silicon (p-type μc-Si:H) thin films have been prepared by radio frequency plasma-enhanced chemical-vapor deposition (RF-PECVD). In this work, the effects of hydrogen dilution, doping ratio, plasma power, deposition pressure and substrate temperature on the growth and the properties of boron-doped microcrystalline silicon (p-type μc-Si:H) thin films are investigated. The electrical, chemical and structural properties are improved with increasing crystallite, which depends on the plasma conditions. For various plasma parameters, the crystalline volume fraction (X(c)), dark conductivity (σ(d)), activation energy (E(a)), hydrogen content (C(H)), surface roughness (S(r)), and micro void fraction (R*) were measured, and they were 0-72%, 4.17-10(-4) S/cm-1.1 S/cm, 0.041-0.113 eV, 3.8-11.5 at.%, 3.2 nm-12.2 nm, and 0.47-0.80, respectively. The film with R* of 0.47 and C(H) of about 5 at.% belonged to a region of low disorder, and acted as a good passivation layer.
通过射频等离子体增强化学气相沉积(RF-PECVD)制备了高导电性的硼掺杂微晶硅(p型μc-Si:H)薄膜。在这项工作中,研究了氢气稀释、掺杂比例、等离子体功率、沉积压力和衬底温度对硼掺杂微晶硅(p型μc-Si:H)薄膜生长和性能的影响。随着微晶的增加,电学、化学和结构性能得到改善,这取决于等离子体条件。对于各种等离子体参数,测量了晶体体积分数(X(c))、暗电导率(σ(d))、激活能(E(a))、氢含量(C(H))、表面粗糙度(S(r))和微孔隙率(R*),它们分别为0-72%、4.17-10(-4) S/cm-1.1 S/cm、0.041-0.113 eV、3.8-11.5 at.%、3.2 nm-12.2 nm和0.47-0.80。R*为0.47且C(H)约为5 at.%的薄膜属于低无序区域,可作为良好的钝化层。