Wang Wenliang, Yang Weijia, Liu Zuolian, Wang Haiyan, Wen Lei, Li Guoqiang
State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Wushan Road, Guangzhou 510640, China.
1] State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Wushan Road, Guangzhou 510640, China [2] Department of Electronic Materials, School of Materials Science and Engineering, South China University of Technology, Wushan Road, Guangzhou 510640, China.
Sci Rep. 2015 Jun 19;5:11480. doi: 10.1038/srep11480.
High-quality AlN epitaxial films have been grown on Si substrates by pulsed laser deposition (PLD) by effective control of the interfacial reactions between AlN films and Si substrates. The surface morphology, crystalline quality and interfacial property of as-grown AlN/Si hetero-interfaces obtained by PLD have been systemically studied. It is found that the amorphous SiAlN interfacial layer is formed during high temperature growth, which is ascribed to the serious interfacial reactions between Si atoms diffused from the substrates and the AlN plasmas produced by the pulsed laser when ablating the AlN target during the high temperature growth. On the contrary, abrupt and sharp AlN/Si hetero-interfaces can be achieved by effectively controlling the interfacial reactions at suitable growth temperature. The mechanisms for the evolution of interfacial layer from the amorphous SiAlN layer to the abrupt and sharp AlN/Si hetero-interfaces by PLD are hence proposed. This work of obtaining the abrupt interfaces and the flat surfaces for AlN films grown by PLD is of paramount importance for the application of high-quality AlN-based devices on Si substrates.
通过有效控制氮化铝(AlN)薄膜与硅(Si)衬底之间的界面反应,采用脉冲激光沉积(PLD)技术在Si衬底上生长出了高质量的AlN外延薄膜。对通过PLD获得的生长态AlN/Si异质界面的表面形貌、晶体质量和界面特性进行了系统研究。研究发现,在高温生长过程中会形成非晶态的SiAlN界面层,这归因于在高温生长期间,从衬底扩散出来的Si原子与脉冲激光烧蚀AlN靶材时产生的AlN等离子体之间发生了严重的界面反应。相反,通过在合适的生长温度下有效控制界面反应,可以实现陡峭且清晰的AlN/Si异质界面。因此,提出了通过PLD使界面层从非晶态SiAlN层演变为陡峭且清晰的AlN/Si异质界面的机制。这项通过PLD获得AlN薄膜陡峭界面和平整表面的工作,对于在Si衬底上应用高质量AlN基器件至关重要。