Núñez-Cascajero Arántzazu, Naranjo Fernando B, de la Mata María, Molina Sergio I
Departamento de Electrónica, Universidad de Alcalá, GRIFO, 28871 Alcalá de Henares, Spain.
Departamento de Tecnología Electrónica, Universidad Carlos III de Madrid, 28911 Leganés, Spain.
Materials (Basel). 2021 Apr 27;14(9):2236. doi: 10.3390/ma14092236.
Compact AlInN layers were grown by radiofrequency sputtering on bare and 15 nm-thick AlN-buffered Si (111) substrates. The crystalline quality of the AlInN layers was studied by high-resolution X-ray diffraction measurements and transmission electron microscopy. Both techniques show an improvement of the structural properties when the AlInN layer is grown on a 15 nm-thick AlN buffer. The layer grown on bare silicon exhibits a thin amorphous interfacial layer between the substrate and the AlInN, which is not present in the layer grown on the AlN buffer layer. A reduction of the density of defects is also observed in the layer grown on the AlN buffer.
通过射频溅射在裸露的和15纳米厚的氮化铝缓冲的硅(111)衬底上生长致密的氮化铝铟层。通过高分辨率X射线衍射测量和透射电子显微镜研究了氮化铝铟层的晶体质量。当在15纳米厚的氮化铝缓冲层上生长氮化铝铟层时,这两种技术都显示出结构性能的改善。在裸硅上生长的层在衬底和氮化铝铟之间呈现出一个薄的非晶界面层,而在氮化铝缓冲层上生长的层中不存在该界面层。在氮化铝缓冲层上生长的层中也观察到缺陷密度的降低。