[Corrosion of Ag-Pd-Cu alloys in saline solution. Amount of released elements and electrochemical corrosion].

The effect of the Pd content on corrosion and tarnish resistance in twelve experimental alloys was investigated. The alloys were prepared with a composition of Pd content from 20.1 to 30.1 at %. The composition of the alloys Ag-20% Pd, Ag-25% Pd and Ag-30% Pd was varied by adding Cu 5 wt%, 10 wt% and 15 wt% to each of them. The corrosion resistance was estimated by the amount of the released Ag, Cu and by electrochemical corrosion behavior in 0.86% NaCl solution at 37 degrees C. The tarnish resistance was assessed using a spectrophotometer. The test solutions included 0.86% NaCl solution, 0.1% Na2S solution and a mixture of 1.0% lactic acid and 0.1% Na2S, all at 37 degrees C, in sealed containers. The results are summarized as follows. The larger the amount of Pd in Ag-Pd binary alloys and Ag-Pd-Cu ternary alloys, the more stable was the release and the release rate of Ag, Cu and corrosion resistance increased in 0.86% NaCl solution. The addition of Cu to Ag-Pd binary alloys increased the release and release rate of Ag, but there was a shift of the rest potential in the noble direction. A relationship was found between the amount of Ag and Cu released from Ag-Pd-Cu ternary alloys. In this study, an increase in corrosion resistance was observed when the content of Pd in Ag-Pd binary alloys was 25 wt%. Furthermore, it was also observed that Ag-Pd-Cu ternary alloys need an additional 30 wt% Pd for corrosion resistance. Moreover, the addition of Cu must be kept lower than 10 wt%. The tarnish resistance of the twelve experimental alloys was good in 0.86% NaCl solution but was barely improved with increased in the Pd content in sulfide solution. The correlation between electrochemical corrosion behavior and tarnish resistance was not significant, but the correlation between the amount of Ag, Cu release from Ag-Pd-Cu ternary alloys and tarnish resistance was remarkable.