Niemi L, Hensten-Pettersen A
J Biomed Mater Res. 1985 May-Jun;19(5):549-61. doi: 10.1002/jbm.820190507.
The cytotoxicity and its correlation to alloy composition, structure, corrosion, as well as galvanic coupling was studied with 12 Ag-Pd-Cu-type alloys, one conventional type III gold alloy and pure Ag, Cu, and Pd. The agar overlay cell culture technique was used. Single phase binary CuPd alloys were only slightly cytotoxic below a Cu content of 30 wt%. The tested multiphase alloys were all toxic, but no correlation between toxicity and Cu content could be observed. Solid solution annealing increased the cytotoxicity of a multiphase alloy. Exposure of a single phase alloy to an artificial saliva for 1 week prior to the test decreased its cytotoxicity significantly. Galvanic coupling of the alloys through an outer copper wire decreased their cytotoxicity.
使用12种银钯铜型合金、一种传统III型金合金以及纯银、铜和钯，研究了细胞毒性及其与合金成分、结构、腐蚀以及电偶耦合的关系。采用琼脂覆盖细胞培养技术。单相二元铜钯合金在铜含量低于30 wt%时细胞毒性仅略有增加。所测试的多相合金均具有毒性，但未观察到毒性与铜含量之间的相关性。固溶退火增加了多相合金的细胞毒性。在测试前，将单相合金暴露于人工唾液中1周可显著降低其细胞毒性。通过外部铜线使合金形成电偶耦合可降低其细胞毒性。
