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探究氧化物衍生铜电催化剂上 CO 还原的活性表面位点。

Probing the Active Surface Sites for CO Reduction on Oxide-Derived Copper Electrocatalysts.

机构信息

†Center for Individual Nanoparticle Functionality, Department of Physics, Technical University of Denmark (DTU), Kongens Lyngby, Denmark.

‡Department of Chemistry, Stanford University, Stanford, California 94305, United States.

出版信息

J Am Chem Soc. 2015 Aug 12;137(31):9808-11. doi: 10.1021/jacs.5b06227. Epub 2015 Jul 30.

Abstract

CO electroreduction activity on oxide-derived Cu (OD-Cu) was found to correlate with metastable surface features that bind CO strongly. OD-Cu electrodes prepared by H2 reduction of Cu2O precursors reduce CO to acetate and ethanol with nearly 50% Faradaic efficiency at moderate overpotential. Temperature-programmed desorption of CO on OD-Cu revealed the presence of surface sites with strong CO binding that are distinct from the terraces and stepped sites found on polycrystalline Cu foil. After annealing at 350 °C, the surface-area corrected current density for CO reduction is 44-fold lower and the Faradaic efficiency is less than 5%. These changes are accompanied by a reduction in the proportion of strong CO binding sites. We propose that the active sites for CO reduction on OD-Cu surfaces are strong CO binding sites that are supported by grain boundaries. Uncovering these sites is a first step toward understanding the surface chemistry necessary for efficient CO electroreduction.

摘要

氧化物衍生铜(OD-Cu)上的 CO 电还原活性与强结合 CO 的亚稳表面特征相关。通过 H2 还原 Cu2O 前体制备的 OD-Cu 电极在适度过电势下将 CO 还原为乙酸盐和乙醇,法拉第效率接近 50%。CO 在 OD-Cu 上的程序升温脱附表明存在具有强 CO 结合能力的表面位,这些表面位与多晶 Cu 箔上的平台和阶跃位不同。在 350°C 退火后,表面面积校正的 CO 还原电流密度降低了 44 倍,法拉第效率小于 5%。这些变化伴随着强 CO 结合位比例的减少。我们提出,OD-Cu 表面 CO 还原的活性位是由晶界支撑的强 CO 结合位。揭示这些位点是理解高效 CO 电还原所需表面化学的第一步。

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