†Center for Individual Nanoparticle Functionality, Department of Physics, Technical University of Denmark (DTU), Kongens Lyngby, Denmark.
‡Department of Chemistry, Stanford University, Stanford, California 94305, United States.
J Am Chem Soc. 2015 Aug 12;137(31):9808-11. doi: 10.1021/jacs.5b06227. Epub 2015 Jul 30.
CO electroreduction activity on oxide-derived Cu (OD-Cu) was found to correlate with metastable surface features that bind CO strongly. OD-Cu electrodes prepared by H2 reduction of Cu2O precursors reduce CO to acetate and ethanol with nearly 50% Faradaic efficiency at moderate overpotential. Temperature-programmed desorption of CO on OD-Cu revealed the presence of surface sites with strong CO binding that are distinct from the terraces and stepped sites found on polycrystalline Cu foil. After annealing at 350 °C, the surface-area corrected current density for CO reduction is 44-fold lower and the Faradaic efficiency is less than 5%. These changes are accompanied by a reduction in the proportion of strong CO binding sites. We propose that the active sites for CO reduction on OD-Cu surfaces are strong CO binding sites that are supported by grain boundaries. Uncovering these sites is a first step toward understanding the surface chemistry necessary for efficient CO electroreduction.
氧化物衍生铜(OD-Cu)上的 CO 电还原活性与强结合 CO 的亚稳表面特征相关。通过 H2 还原 Cu2O 前体制备的 OD-Cu 电极在适度过电势下将 CO 还原为乙酸盐和乙醇,法拉第效率接近 50%。CO 在 OD-Cu 上的程序升温脱附表明存在具有强 CO 结合能力的表面位,这些表面位与多晶 Cu 箔上的平台和阶跃位不同。在 350°C 退火后,表面面积校正的 CO 还原电流密度降低了 44 倍,法拉第效率小于 5%。这些变化伴随着强 CO 结合位比例的减少。我们提出,OD-Cu 表面 CO 还原的活性位是由晶界支撑的强 CO 结合位。揭示这些位点是理解高效 CO 电还原所需表面化学的第一步。