Cui Xieliang, Ding Peng, Zhuang Nan, Shi Liyi, Song Na, Tang Shengfu
Research Center of Nanoscience and Nanotechnology, Shanghai University , 99 Shangda Road, Shanghai 200444, People's Republic of China.
Department of Polymer Materials, Shanghai University , 99 Shangda Road, Shanghai 200444, People's Republic of China.
ACS Appl Mater Interfaces. 2015 Sep 2;7(34):19068-75. doi: 10.1021/acsami.5b04444. Epub 2015 Aug 24.
In this work, we reported a synergistic effect of boron nitride (BN) with graphene nanosheets on the enhancement of thermal conductive and mechanical properties of polymeric composites. Here, few layered BN (s-BN) and graphene (s-GH) were used and obtained by liquid exfoliation method. The polystyrene (PS) and polyamide 6 (PA) composites were obtained via solution blending method and subsequently hot-pressing. The experimental results suggested that the thermal conductivity (TC) of the PS and PA composites increases with additional introduction of s-BN. For example, compared with the composites containing 20 wt % s-GH, additional introduction of only 1.5 wt % s-BN could increase the TC up to 38 and 34% in polystyrene (PS) and polyamide 6 (PA) matrix, respectively. Meanwhile, the mechanical properties of the composites were synchronously enhanced. It was found that s-BN filled in the interspaces of s-GH sheets and formed s-BN/s-GH stacked structure, which were helpful for the synchronously improving TC and mechanical properties of the polymeric materials.
在本工作中,我们报道了氮化硼(BN)与石墨烯纳米片在增强聚合物复合材料的热导率和力学性能方面的协同效应。在此,使用了通过液相剥离法制备的少层BN(s-BN)和石墨烯(s-GH)。通过溶液共混法随后热压得到聚苯乙烯(PS)和聚酰胺6(PA)复合材料。实验结果表明,随着s-BN的额外引入,PS和PA复合材料的热导率(TC)增加。例如,与含有20 wt% s-GH的复合材料相比,仅额外引入1.5 wt%的s-BN就能使聚苯乙烯(PS)和聚酰胺6(PA)基体中的TC分别提高38%和34%。同时,复合材料的力学性能也同步提高。发现s-BN填充在s-GH片层的间隙中并形成s-BN/s-GH堆叠结构,这有助于同步提高聚合物材料的TC和力学性能。