ACS Appl Mater Interfaces. 2018 May 16;10(19):16812-16821. doi: 10.1021/acsami.8b03522. Epub 2018 May 2.
Highly thermal conductive polymer composites with minimized content of fillers are desirable for handling the issue in thermal management in modern electronics. However, the difficulty of filler dispersion restricts the heat dissipation performance of thermoplastic composites and the intermolecular interaction is another crucial factor in this problem. In the present study, the hydrogen bond was used to regulate the formation of the three-dimensional boron nitride (3D BN) interconnected network to act as a high thermal conductive network in thermoplastic polyamide-imide (PAI) materials. The prepared electrical insulated PAI/3D-BN composites have a thermal conductivity (TC) of 1.17 W·m·K at a low BN loading of 4 wt %/2 vol % and exhibit a thermal conductivity enhancement of 409%. We attribute the increased TC to the construction of 3D BN interconnected network and the hydrogen bond regulated between hydroxylated BN and polyvinyl alcohol, in which an effective thermal conductive network is constructed. This study provides a guided hydrogen bond strategy for thermally conductive polymer composites with good mechanical and electrical insulation properties in thermal management and other applications.
对于处理现代电子设备热管理中的问题，高热导率聚合物复合材料具有最小化的填充剂含量是非常理想的。然而，填充剂分散的难度限制了热塑性复合材料的散热性能，分子间相互作用是这一问题的另一个关键因素。在本研究中，氢键被用来调节三维氮化硼（3D BN）的形成相互连接的网络，以在热塑性聚酰胺-酰亚胺（PAI）材料中充当高导热网络。所制备的电绝缘 PAI/3D-BN 复合材料在 BN 负载量低至 4wt%/2vol%时具有 1.17W·m·K 的热导率，表现出 409%的热导率增强。我们将 TC 的增加归因于 3D BN 相互连接网络的构建以及羟基化 BN 和聚乙烯醇之间氢键的调节，其中构建了有效的热导网络。本研究为具有良好力学和电绝缘性能的热管理及其他应用的导热聚合物复合材料提供了一种有指导意义的氢键策略。
