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来自簇毛麦的E3泛素连接酶基因CMPG1-V有助于普通小麦(Triticum aestivum L.)对白粉病的抗性。

E3 ubiquitin ligase gene CMPG1-V from Haynaldia villosa L. contributes to powdery mildew resistance in common wheat (Triticum aestivum L.).

作者信息

Zhu Yanfei, Li Yingbo, Fei Fei, Wang Zongkuan, Wang Wei, Cao Aizhong, Liu Yuan, Han Shuang, Xing Liping, Wang Haiyan, Chen Wei, Tang Sanyuan, Huang Xiahe, Shen Qianhua, Xie Qi, Wang Xiue

机构信息

State Key Laboratory of Crop Genetics and Germplasm Enhancement, Cytogenetics Institute, Nanjing Agricultural University/Jiangsu Collaborative Innovation Center for Modern Crop Production, Nanjing, Jiangsu, 210095, China.

Institute of Genetics and Developmental Biology, Chinese Academy of Sciences, Beijing, 100101, China.

出版信息

Plant J. 2015 Oct;84(1):154-68. doi: 10.1111/tpj.12966.

Abstract

Powdery mildew is one of the most devastating wheat fungal diseases. A diploid wheat relative, Haynaldia villosa L., is highly resistant to powdery mildew, and its genetic resource of resistances, such as the Pm21 locus, is now widely used in wheat breeding. Here we report the cloning of a resistance gene from H. villosa, designated CMPG1-V, that encodes a U-box E3 ubiquitin ligase. Expression of the CMPG1-V gene was induced in the leaf and stem of H. villosa upon inoculation with Blumeria graminis f. sp. tritici (Bgt) fungus, and the presence of Pm21 is essential for its rapid induction of expression. CMPG1-V has conserved key residues for E3 ligase, and possesses E3 ligase activity in vitro and in vivo. CMPG1-V is localized in the nucleus, endoplasmic reticulum, plasma membrane and partially in trans-Golgi network/early endosome vesicles. Transgenic wheat over-expressing CMPG1-V showed improved broad-spectrum powdery mildew resistance at seedling and adult stages, associated with an increase in expression of salicylic acid-responsive genes, H2 O2 accumulation, and cell-wall protein cross-linking at the Bgt infection sites, and the expression of CMPG1-V in H. villosa was increased when treated with salicylic acid, abscisic acid and H2 O2 . These results indicate the involvement of E3 ligase in defense responses to Bgt fungus in wheat, particularly in broad-spectrum disease resistance, and suggest association of reactive oxidative species and the phytohormone pathway with CMPG1-V-mediated powdery mildew resistance.

摘要

白粉病是最具破坏性的小麦真菌病害之一。一种二倍体小麦近缘种,绒毛偃麦草(Haynaldia villosa L.),对白粉病具有高度抗性,其抗性遗传资源,如Pm21位点,目前已广泛应用于小麦育种。在此,我们报道了从绒毛偃麦草中克隆出一个抗性基因,命名为CMPG1-V,它编码一个U-box E3泛素连接酶。在用小麦白粉病菌(Blumeria graminis f. sp. tritici,Bgt)接种后,CMPG1-V基因在绒毛偃麦草的叶片和茎中被诱导表达,并且Pm21的存在对其快速诱导表达至关重要。CMPG1-V具有E3连接酶的保守关键残基,并且在体外和体内均具有E3连接酶活性。CMPG1-V定位于细胞核、内质网、质膜以及部分反式高尔基体网络/早期内体囊泡中。过表达CMPG1-V的转基因小麦在幼苗期和成年期均表现出对白粉病的广谱抗性增强,这与水杨酸响应基因表达增加、H2O2积累以及Bgt感染部位的细胞壁蛋白交联有关,并且用水杨酸、脱落酸和H2O2处理后,绒毛偃麦草中CMPG1-V的表达增加。这些结果表明E3连接酶参与了小麦对Bgt真菌的防御反应,特别是在广谱抗病性方面,并且表明活性氧和植物激素途径与CMPG1-V介导的白粉病抗性相关。

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