Lee Jae Chun, Kim Sun Kyu, Trung Trinh Van, Lee Dong Bok
J Nanosci Nanotechnol. 2015 Jan;15(1):579-82. doi: 10.1166/jnn.2015.8355.
Thin CrAlCuN films with a composition of 21.5Cr-18.6Al-5.6Cu-54.3N (at.%) were deposited on steel substrates by the cathodic arc plasma deposition, and oxidized for up to 50 h in air. They consisted of alternating crystalline CrN/AlN nano-multilayers where Cu was incorporated. At 800 degrees C, a thin Cr2O3 layer formed. At 900 and 1000 degrees C, an outer Cr2O3 layer and an inner (α-Al2O3, Cr2O3)-mixed layer formed. Copper diffused outward to a small extent during oxidation. The film had good oxidation resistance, owing to the formation of the protective Cr2O3 and α-Al2O3.
通过阴极电弧等离子体沉积法在钢基底上沉积了成分（原子百分比）为21.5Cr - 18.6Al - 5.6Cu - 54.3N的CrAlCuN薄膜，并在空气中氧化长达50小时。它们由交替的结晶CrN/AlN纳米多层膜组成，其中掺入了铜。在800℃时，形成了一层薄的Cr₂O₃层。在900℃和1000℃时，形成了外层Cr₂O₃层和内层（α - Al₂O₃，Cr₂O₃）混合层。氧化过程中铜向外有少量扩散。由于形成了保护性的Cr₂O₃和α - Al₂O₃，该薄膜具有良好的抗氧化性。
