Xiao Xinli, Kong Deyan, Qiu Xueying, Zhang Wenbo, Liu Yanju, Zhang Shen, Zhang Fenghua, Hu Yang, Leng Jinsong
Harbin Institute of Technology, Department of Chemistry, No. 92 West Dazhi Street, Harbin 150001, People's Republic of China.
Harbin Institute of Technology, Centre for Composite Materials and Structures, No. 2 YiKuang Street, Harbin 150080, People's Republic of China.
Sci Rep. 2015 Sep 18;5:14137. doi: 10.1038/srep14137.
High temperature shape memory polymers that can withstand the harsh temperatures for durable applications are synthesized, and the aromatic polyimide chains with flexible linkages within the backbone act as reversible phase. High molecular weight (Mn) is demanded to form physical crosslinks as fixed phase of thermoplastic shape memory polyimide, and the relationship between Mn and glass transition temperature (Tg) is explored. Thermoset shape memory polyimide shows higher Tg and storage modulus, better shape fixity than thermoplastic counterpart due to the low-density covalent crosslinking, and the influence of crosslinking on physical properties are studied. The mechanism of high temperature shape memory effects based on chain flexibility, molecular weight and crosslink density is proposed. Exposure to thermal cycling from +150 °C to -150 °C for 200 h produces negligible effect on the properties of the shape memory polyimide, and the possible mechanism of high and low temperature resistant property is discussed.
合成了能够承受恶劣温度以用于耐用应用的高温形状记忆聚合物,主链中带有柔性连接的芳香族聚酰亚胺链充当可逆相。需要高分子量(Mn)来形成作为热塑性形状记忆聚酰亚胺固定相的物理交联,并探索了Mn与玻璃化转变温度(Tg)之间的关系。由于低密度共价交联,热固性形状记忆聚酰亚胺表现出比热塑性对应物更高的Tg和储能模量、更好的形状固定性,并研究了交联对物理性能的影响。提出了基于链柔性、分子量和交联密度的高温形状记忆效应机制。在+150°C至-150°C之间进行200小时的热循环对形状记忆聚酰亚胺的性能产生的影响可忽略不计,并讨论了其耐高低温性能的可能机制。