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半结晶聚酰胺热固性塑料的高温形状记忆行为。

High-Temperature Shape Memory Behavior of Semicrystalline Polyamide Thermosets.

机构信息

National Engineering Research Center for Biotechnology , Nanjing Tech University , Nanjing 211800 , China.

Faculty of Aerospace Engineering , Delft University of Technology , Kluyverweg 1 , 2629 HS Delft , The Netherlands.

出版信息

ACS Appl Mater Interfaces. 2018 Jun 6;10(22):19106-19115. doi: 10.1021/acsami.8b03658. Epub 2018 May 21.

Abstract

We have explored semicrystalline poly(decamethylene terephthalamide) (PA 10T) based thermosets as single-component high-temperature (>200 °C) shape memory polymers (SMPs). The PA 10T thermosets were prepared from reactive thermoplastic precursors. Reactive phenylethynyl (PE) functionalities were either attached at the chain termini or placed as side groups along the polymer main chain. The shape fixation and recovery performance of the thermoset films were investigated using a rheometer in torsion mode. By controlling the M of the reactive oligomers, or the PE concentration of the PE side-group functionalized copolyamides, we were able to design dual-shape memory PA 10T thermosets with a broad recovery temperature range of 227-285 °C. The thermosets based on the 1000 g mol reactive PE precursor and the copolyamide with 15 mol % PE side groups show the highest fixation rate (99%) and recovery rate (≥90%). High temperature triple-shape memory behavior can be achieved as well when we use the melt transition ( T ≥ 200 °C) and the glass transition ( T = ∼125 °C) as the two switches. The recovery rate of the two recovery steps are highly dependent on the crystallinity of the thermosets and vary within a wide range of 74%-139% and 40-82% for the two steps, respectively. Reversible shape memory events could also be demonstrated when we perform a forward and backward deformation in a triple shape memory cycle. We also studied the angular recovery velocity as a function of temperature, which provides a thermokinematic picture of the shape recovery process and helps to program for desired shape memory behavior.

摘要

我们探索了半结晶聚(十亚甲基对苯二甲酰胺)(PA10T)基热固性聚合物作为单一成分的高温(>200°C)形状记忆聚合物(SMP)。PA10T 热固性聚合物是由反应性热塑性前体制备的。反应性苯乙炔基(PE)官能团要么连接在链端,要么作为侧基放置在聚合物主链上。通过在扭转模式下使用流变仪研究了热固性薄膜的形状固定和恢复性能。通过控制反应性低聚物的 M,或 PE 侧基官能化共聚酰胺中的 PE 浓度,我们能够设计具有 227-285°C 宽恢复温度范围的双形状记忆 PA10T 热固性聚合物。基于 1000g/mol 反应性 PE 前体的热固性聚合物和具有 15mol%PE 侧基的共聚物表现出最高的固定率(99%)和恢复率(≥90%)。当我们将熔体转变(T≥200°C)和玻璃化转变(T=∼125°C)用作两个开关时,也可以实现高温三形状记忆行为。两个恢复步骤的恢复率高度依赖于热固性聚合物的结晶度,在两个步骤中分别在 74%-139%和 40-82%的宽范围内变化。在三形状记忆循环中进行正向和反向变形时,也可以证明可逆形状记忆事件。我们还研究了角恢复速度作为温度的函数,这提供了形状恢复过程的热动图像,并有助于为所需的形状记忆行为编程。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/343c/5994727/e52fc121aac7/am-2018-03658q_0010.jpg

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