Integrated Nanotechnology Laboratory, Computer Electrical and Mathematical Science and Engineering (CEMSE) Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia.
Adv Mater. 2016 Jun;28(22):4219-49. doi: 10.1002/adma.201504236. Epub 2015 Nov 26.
Flexible and stretchable electronics can dramatically enhance the application of electronics for the emerging Internet of Everything applications where people, processes, data and devices will be integrated and connected, to augment quality of life. Using naturally flexible and stretchable polymeric substrates in combination with emerging organic and molecular materials, nanowires, nanoribbons, nanotubes, and 2D atomic crystal structured materials, significant progress has been made in the general area of such electronics. However, high volume manufacturing, reliability and performance per cost remain elusive goals for wide commercialization of these electronics. On the other hand, highly sophisticated but extremely reliable, batch-fabrication-capable and mature complementary metal oxide semiconductor (CMOS)-based technology has facilitated tremendous growth of today's digital world using thin-film-based electronics; in particular, bulk monocrystalline silicon (100) which is used in most of the electronics existing today. However, one fundamental challenge is that state-of-the-art CMOS electronics are physically rigid and brittle. Therefore, in this work, how CMOS-technology-enabled flexible and stretchable electronics can be developed is discussed, with particular focus on bulk monocrystalline silicon (100). A comprehensive information base to realistically devise an integration strategy by rational design of materials, devices and processes for Internet of Everything electronics is offered.
可拉伸和可延展电子产品可以极大地增强电子产品在新兴的万物互联应用中的应用,在这些应用中,人员、流程、数据和设备将被集成和连接,以提高生活质量。使用天然的柔韧聚合物基底,并结合新兴的有机和分子材料、纳米线、纳米带、纳米管和二维原子晶体结构材料,在这些电子产品的一般领域已经取得了重大进展。然而,高容量制造、可靠性和性能成本比仍然是这些电子产品广泛商业化的难以实现的目标。另一方面,高度复杂但极其可靠、批处理能力强且成熟的互补金属氧化物半导体 (CMOS) 技术,通过基于薄膜的电子产品,极大地促进了当今数字世界的发展;特别是在当今大多数电子产品中使用的体单晶硅 (100)。然而,一个基本的挑战是,最先进的 CMOS 电子产品在物理上是刚性和脆性的。因此,在这项工作中,讨论了如何开发基于 CMOS 技术的可拉伸和可延展电子产品,特别关注体单晶硅 (100)。提供了一个全面的信息基础,通过对材料、器件和工艺的合理设计,为万物互联电子产品设计出一种集成策略。