Krielaart M A R, Vermeer C H, Vanapalli S
University of Twente, P.O. BOX 217, 7500 AE Enschede, The Netherlands.
SuperACT, Marterstraat 66, 7559 AJ Hengelo, The Netherlands.
Rev Sci Instrum. 2015 Nov;86(11):115116. doi: 10.1063/1.4936356.
Heat switches are devices that can change from a thermally conducting (on-) state to an insulating (off-) state whenever the need arises. They enable adaptive thermal management strategies in which cooling rates are altered either spatially or temporally, leading to a substantial reduction in the energy and mass budget of a large range of systems. State-of-the-art heat switches are only rarely employed in thermal system architectures, since they are rather bulky and have a limited thermal performance (expressed as the heat transfer ratio between the on- and off-state heat conductance). Using selective laser melting additive manufacturing technology, also known as 3D printing, we developed a compact flat-panel gas-gap heat switch that offers superior thermal performance, is simpler and more economic to produce and assemble, contains no moving parts, and is more reliable because it lacks welded joints. The manufactured rectangular panel heat switch has frontal device dimensions of 10 cm by 10 cm, thickness of 3.2 mm and weighs just 121 g. An off heat conductance of 0.2 W/K and on-off heat conductance ratio of 38 is observed at 295 K.
热开关是一种能够在需要时从热传导（导通）状态转变为绝缘（关断）状态的装置。它们实现了自适应热管理策略，其中冷却速率可在空间或时间上改变，从而大幅降低了一系列系统的能量和质量预算。由于目前最先进的热开关相当笨重且热性能有限（以导通和关断状态热导率之间的传热比表示），因此在热系统架构中很少使用。利用选择性激光熔化增材制造技术（也称为3D打印），我们开发了一种紧凑的平板气隙热开关，它具有卓越的热性能，生产和组装更简单、更经济，没有活动部件，并且由于没有焊接接头而更可靠。制造的矩形面板热开关的正面器件尺寸为10厘米×10厘米，厚度为3.2毫米，重量仅为121克。在295K时观察到关断热导率为0.2W/K，开-关热导率比为38。
