Gerbig Y B, Michaels C A, Bradby J E, Haberl B, Cook R F
Material Measurement Laboratory, National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, Maryland, 20899; Mechanical Engineering Department, University of Maryland, College Park, Maryland, 20742.
Material Measurement Laboratory, National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, Maryland, 20899.
Phys Rev B Condens Matter Mater Phys. 2015 Dec;92(21). doi: 10.1103/PhysRevB.92.214110. Epub 2015 Dec 17.
Indentation-induced plastic deformation of amorphous silicon (a-Si) thin films was studied by Raman imaging of the deformed contact region of an indented sample, employing a Raman spectroscopy-enhanced instrumented indentation technique. Quantitative analyses of the generated Raman maps provide unique, new insight into the phase behavior of as-implanted a-Si. In particular, the occurrence and evolving spatial distribution of changes in the a-Si structure caused by processes, such as polyamorphization and crystallization, induced by indentation loading were measured. The experimental results are linked with previously published work on the plastic deformation of a-Si under hydrostatic compression and shear deformation to establish a sequence for the development of deformation of a-Si under indentation loading. The sequence involves three distinct deformation mechanisms of a-Si: (1) reversible deformation, (2) increase in coordination defects (onset of plastic deformation), and (3) phase transformation. Estimated conditions for the occurrence of these mechanisms are given with respect to relevant intrinsic and extrinsic parameters, such as indentation stress, volumetric strain, and bond angle distribution (a measure for the structural order of the amorphous network). The induced volumetric strains are accommodated solely by reversible deformation of the tetrahedral network when exposed to small indentation stresses. At greater indentation stresses, the increased volumetric strains in the tetrahedral network lead to the formation of predominately five-fold coordination defects, which seems to mark the onset of irreversible or plastic deformation of the a-Si thin film. Further increase in the indentation stress appears to initiate the formation of six-fold coordinated atomic arrangements. These six-fold coordinated arrangements may maintain their amorphous tetrahedral structure with a high density of coordination defects or nucleate as a new crystalline -tin phase within the a-Si network.
采用拉曼光谱增强的仪器化压痕技术,通过对压痕样品变形接触区域进行拉曼成像,研究了非晶硅(a-Si)薄膜的压痕诱导塑性变形。对生成的拉曼图谱进行定量分析,为注入态a-Si的相行为提供了独特的新见解。特别是,测量了由压痕加载引起的诸如多晶化和结晶等过程导致的a-Si结构变化的发生及其演变的空间分布。实验结果与先前发表的关于a-Si在静水压缩和剪切变形下塑性变形的研究工作相关联,以建立a-Si在压痕加载下变形发展的顺序。该顺序涉及a-Si的三种不同变形机制:(1)可逆变形,(2)配位缺陷增加(塑性变形开始),以及(3)相变。针对相关的内在和外在参数,如压痕应力、体积应变和键角分布(非晶网络结构有序性的一种度量),给出了这些机制发生的估计条件。当暴露于小的压痕应力时,诱导的体积应变仅通过四面体网络的可逆变形来容纳。在更大的压痕应力下,四面体网络中增加的体积应变导致主要形成五配位缺陷,这似乎标志着a-Si薄膜不可逆或塑性变形的开始。压痕应力的进一步增加似乎引发了六配位原子排列的形成。这些六配位排列可能保持其具有高密度配位缺陷的非晶四面体结构,或者在a-Si网络内形核为新的晶体 -锡相。