Dushaq Ghada, Nayfeh Ammar, Rasras Mahmoud
Electrical and Computer Engineering, New York University, Abu Dhabi, UAE.
Electrical Engineering and Computer Science, Khalifa University, Abu Dhabi, UAE.
Sci Rep. 2019 Feb 7;9(1):1593. doi: 10.1038/s41598-018-38440-3.
Thin Ge films directly grown on Si substrate using two-step low temperature growth technique are subjected to low load nano-indentation at room temperature. The nano-indentation is carried out using a Berkovich diamond tip (R ~ 20 nm). The residual impressions are studied using ex-situ Raman Micro-Spectroscopy, Atomic Force Microscopy combined system, and Transmission Electron Microscopy. The analysis of residual indentation impressions and displacement-load curves show evidence of deformation by phase transformation at room temperature under a critical pressure ranging from 4.9GPa-8.1GPa. Furthermore, the formation of additional Ge phases such as r8-Ge, hd-Ge, and amorphous Ge as a function of indentation depth have been realized. The inelastic deformation mechanism is found to depend critically on the indentation penetration depth. The non-uniform spatial distribution of the shear stress depends on the indentation depth and plays a crucial role in determining which phase is formed. Similarly, nano-indentation fracture response depends on indentation penetration depth. This opens the potential of tuning the contact response of Ge and other semiconductors thin films by varying indentation depth and indenter geometry. Furthermore, this observed effect can be reliably used to induce phase transformation in Ge-on-Si with technological interest as a narrow band gap material for mid-wavelength infrared detection.
采用两步低温生长技术直接生长在硅衬底上的锗薄膜,在室温下进行低载荷纳米压痕测试。纳米压痕测试使用的是贝氏压头(半径约为20纳米)。利用非原位拉曼显微光谱、原子力显微镜联合系统以及透射电子显微镜对残留压痕进行研究。对残留压痕和位移 - 载荷曲线的分析表明,在4.9吉帕至8.1吉帕的临界压力下,室温下存在相变导致的变形证据。此外,还发现了诸如r8 - Ge、hd - Ge和非晶态锗等额外锗相的形成与压痕深度的关系。发现非弹性变形机制主要取决于压痕穿透深度。剪应力的非均匀空间分布取决于压痕深度,并且在决定形成何种相方面起着关键作用。同样,纳米压痕断裂响应也取决于压痕穿透深度。这开启了通过改变压痕深度和压头几何形状来调整锗及其他半导体薄膜接触响应的可能性。此外,这种观察到的效应可可靠地用于在硅基锗中诱导相变,硅基锗作为一种用于中波长红外探测的窄带隙材料具有技术应用价值。