Wang Qiangqiang, Yuan Zheng, Cao Zhurong, Deng Bo, Chen Tao, Deng Keli
Research Center of Laser Fusion, Chinese Academy of Engineering Physics, Mianyang, Sichuan 621900, China.
Rev Sci Instrum. 2016 Jul;87(7):073303. doi: 10.1063/1.4958822.
We present here the results of the simulation work, using the three-dimensional particle-in-cell method, on the performance of the lead glass microchannel plate under saturated state. We calculated the electron cascade process with different DC bias voltages under both self-consistent condition and non-self-consistent condition. The comparative results have demonstrated that the strong self-consistent field can suppress the cascade process and make the microchannel plate saturated. The simulation results were also compared to the experimental data and good agreement was obtained. The simulation results also show that the electron multiplication process in the channel is accompanied by the buildup process of positive charges in the channel wall. Though the interactions among the secondary electron cloud in the channel, the positive charges in the channel wall, and the external acceleration field can make the electron-surface collision more frequent, the collision energy will be inevitably reduced, thus the electron gain will also be reduced.
我们在此展示使用三维粒子模拟方法对饱和状态下铅玻璃微通道板性能进行模拟工作的结果。我们在自洽条件和非自洽条件下，计算了不同直流偏置电压下的电子级联过程。对比结果表明，强自洽场可抑制级联过程并使微通道板饱和。模拟结果还与实验数据进行了比较，获得了良好的一致性。模拟结果还表明，通道中的电子倍增过程伴随着通道壁中正电荷的积累过程。尽管通道中的二次电子云、通道壁中的正电荷和外部加速场之间的相互作用会使电子与表面的碰撞更加频繁，但碰撞能量将不可避免地降低，从而电子增益也会降低。
