光固化机引起的温度升高可缩短牙釉质酸蚀时间。
Temperature Rise Induced by Light Curing Unit Can Shorten Enamel Acid-Etching Time.
作者信息
Najafi Abrandabadi Ahmad, Sheikh-Al-Eslamian Seyedeh Mahsa, Panahandeh Narges
机构信息
Faculty Member, Department of Restorative Dentistry, Dental School, Shahid Beheshti University of Medical Sciences, Tehran, Iran.
Assistant Professor, Dental Research Center, Dental School, Shahid Beheshti University of Medical Sciences, Tehran, Iran.
出版信息
J Dent (Tehran). 2015 Dec;12(12):921-5.
OBJECTIVES
The aim of this in-vitro study was to assess the thermal effect of light emitting diode (LED) light curing unit on the enamel etching time.
MATERIALS AND METHODS
Three treatment groups with 15 enamel specimens each were used in this study: G1: Fifteen seconds of etching, G2: Five seconds of etching, G3: Five seconds of etching plus LED light irradiation (simultaneously). The micro shear bond strength (μSBS) of composite resin to enamel was measured.
RESULTS
The mean μSBS values ± standard deviation were 51.28±2.35, 40.47±2.75 and 50.00±2.59 MPa in groups 1, 2 and 3, respectively. There was a significant difference between groups 1 and 2 (P=0.013) and between groups 2 and 3 (P=0.032) in this respect, while there was no difference between groups 1 and 3 (P=0.932).
CONCLUSION
Simultaneous application of phosphoric acid gel over enamel surface and light irradiation using a LED light curing unit decreased enamel etching time to five seconds without compromising the μSBS.
目的
本体外研究旨在评估发光二极管（LED）光固化机对牙釉质酸蚀时间的热效应。
材料与方法
本研究使用了三个治疗组，每组有15个牙釉质样本：G1：酸蚀15秒；G2：酸蚀5秒；G3：酸蚀5秒加LED光照射（同时进行）。测量复合树脂与牙釉质之间的微剪切粘结强度（μSBS）。
结果
第1、2和3组的平均μSBS值±标准差分别为51.28±2.35、40.47±2.75和50.00±2.59MPa。在这方面，第1组和第2组之间（P = 0.013）以及第2组和第3组之间（P = 0.032）存在显著差异，而第1组和第3组之间没有差异（P = 0.932）。
结论
在牙釉质表面同时应用磷酸凝胶和使用LED光固化机进行光照射可将牙釉质酸蚀时间缩短至5秒，且不影响微剪切粘结强度。
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