Center for Phononics and Thermal Energy Science, School of Physics Science and Engineering, Tongji University, Shanghai 200092, People's Republic of China. Institute for Advanced Study, Tongji University, Shanghai 200092, People's Republic of China.
Nanotechnology. 2016 Nov 18;27(46):465705. doi: 10.1088/0957-4484/27/46/465705. Epub 2016 Oct 19.
The increasing power density and the decreasing dimensions of transistors present severe thermal challenges to the design of modern microprocessors. Furthermore, new technologies such as three-dimensional chip-stack architectures require novel cooling solutions for their thermal management. Here, we demonstrate, through transient heat-dissipation simulations, that a covalently bonded graphene-carbon nanotube (G-CNT) hybrid immersed in water is a promising solution for the ultrafast cooling of such high-temperature and high heat-flux surfaces. The G-CNT hybrid offers a unique platform to integrate the superior axial heat transfer capability of individual CNTs via their parallel arrangement. The immersion of the G-CNT in water enables an additional heat dissipation path via the solid-liquid interaction, allowing for the sustainable cooling of the hot surface under a constant power input of up to 10 000 W cm.
不断增加的晶体管功率密度和缩小的尺寸对现代微处理器的设计带来了严峻的热挑战。此外，三维芯片堆叠架构等新技术对其热管理需要新型冷却解决方案。在这里，我们通过瞬态散热模拟证明，共价键合的石墨烯-碳纳米管（G-CNT）杂化材料沉浸在水中，是为这种高温、高热通量表面实现超快冷却的一种很有前途的解决方案。G-CNT 杂化材料提供了一个独特的平台，通过其平行排列整合了单个 CNT 的卓越轴向传热能力。G-CNT 沉浸在水中，通过固液相互作用提供了额外的散热途径，使得在高达 10000 W cm 的恒定功率输入下，能够持续冷却热表面。
