Department of Electrical and Electronics Engineering, Bilkent University, Ankara, 06800, Turkey.
UNAM-National Nanotechnology Research Center, Bilkent University, Ankara, 06800, Turkey.
Sci Rep. 2016 Dec 7;6:38589. doi: 10.1038/srep38589.
Absorbing infrared radiation efficiently is important for critical applications such as thermal imaging and infrared spectroscopy. Common infrared absorbing materials are not standard in Si VLSI technology. We demonstrate ultra-broadband mid-infrared absorbers based purely on silicon. Broadband absorption is achieved by the combined effects of free carrier absorption, and vibrational and plasmonic absorption resonances. The absorbers, consisting of periodically arranged silicon gratings, can be fabricated using standard optical lithography and deep reactive ion etching techniques, allowing for cost-effective and wafer-scale fabrication of micro-structures. Absorption wavebands in excess of 15 micrometers (5-20 μm) are demonstrated with more than 90% average absorptivity. The structures also exhibit broadband absorption performance even at large angles of incidence (θ = 50°), and independent of polarization.
高效吸收红外辐射对于热成像和红外光谱等关键应用非常重要。常见的红外吸收材料在 Si VLSI 技术中并不标准。我们展示了纯硅基的超宽带中红外吸收体。宽带吸收是通过自由载流子吸收、振动和等离子体吸收共振的综合作用实现的。这些由周期性排列的硅光栅组成的吸收体可以使用标准的光学光刻和深反应离子刻蚀技术制造,允许以经济高效的方式在晶圆级上制造微结构。吸收体的吸收波段超过 15 微米(5-20μm),平均吸收率超过 90%。即使在大入射角(θ=50°)下,这些结构也表现出宽带吸收性能,并且与偏振无关。