Advanced Light Source, Lawrence Berkeley National Laboratory , Berkeley, California 94720, United States.
Tyco Electronics Corporation, TE Connectivity Ltd. , Menlo Park, California 94025, United States.
ACS Appl Mater Interfaces. 2017 Jan 11;9(1):958-964. doi: 10.1021/acsami.6b13956. Epub 2016 Dec 19.
Polyvinylidene fluoride (PVDF) copolymer conductive composites containing 40 vol % copper (Cu) and tin (Sn) fillers are prepared by injection molding. Postmolding thermal annealing is found to increase the electrical conductivity of the composites by an order of magnitude. The volume ratio between Cu and Sn is found to have a significant effect on filler distribution but a weaker effect on electrical conductivity compared to the annealing conditions. Synchrotron X-ray tomography is used to visualize and quantitatively analyze the morphology and distribution of the filler particles, indicating that higher conductivity can be attributed to better dispersion of the low-melting-point Sn filler, which provides better interparticle contact in the Cu network.
聚偏二氟乙烯（PVDF）共聚物导电复合材料含有 40 体积%的铜（Cu）和锡（Sn）填充剂，通过注塑成型制备。发现模后热退火可以将复合材料的电导率提高一个数量级。发现 Cu 和 Sn 的体积比对于填充剂的分布有显著影响，但与退火条件相比，对电导率的影响较弱。同步加速器 X 射线断层摄影术用于可视化和定量分析填充剂颗粒的形态和分布，表明较高的电导率可归因于低熔点 Sn 填充剂更好的分散，这在 Cu 网络中提供了更好的颗粒间接触。
