Evonik Resource Efficiency GmbH, Electronic Solutions, 45772 Marl, Germany.
Institute of Technology for Nanostructures and CENIDE, University of Duisburg-Essen , 47057 Duisburg, Germany.
ACS Appl Mater Interfaces. 2017 Jan 25;9(3):2625-2633. doi: 10.1021/acsami.6b12586. Epub 2017 Jan 12.
Semiconductor inks containing an indium-based oxo alkoxide precursor material were optimized regarding rheology requirements for a commercial 10 pL inkjet printhead. The rheological stability is evaluated by measuring the dynamic viscosity of the formulations for 12 h with a constant shear rate stress under ambient conditions. It is believed that the observed superior stability of the inks is the result of effectively suppressing the hydrolysis and condensation reaction between the metal oxo alkoxide precursor complex and atmospheric water. This can be attributed to a strong precursor coordination and the resulting reduction in ligand exchange dynamics of the solvent tetrahydrofurfuryl alcohol which is used as the main solvent in the formulations. It is also shown that with a proper selection of cosolvents, having high polar Hansen solubility parameter values, the inks drop formation properties and wettability can be fine-tuned by maintaining the inks rheological stability. Good drop jetting performance without satellite formation and high drop velocities of 8.25 m/s were found with the support of dimensionless numbers and printability windows. By printing single 10 pL ink dots onto short channel indium-tin-oxide electrodes, InO calcination at 350 °C and a solution-processed back-channel protection, high average saturation mobility of approximately 10 cm/(V s) are demonstrated in a bottom-contact coplanar thin-film transistor device structure.
含铟基氧烷醇盐前体材料的半导体油墨在商业 10 pL 喷墨打印头方面具有流变学要求方面进行了优化。在环境条件下,以恒定剪切速率应力测量配方 12 小时的动态粘度来评估流变稳定性。据信,油墨观察到的优异稳定性是有效抑制金属氧烷醇盐前体配合物与大气水之间的水解和缩合反应的结果。这归因于前体的强配位以及用作配方中主要溶剂的溶剂四氢呋喃的配体交换动力学的降低。还表明,通过适当选择具有高极性 Hansen 溶解度参数值的共溶剂,可以通过保持油墨的流变稳定性来微调油墨的液滴形成特性和润湿性。通过使用无量纲数和可打印窗口支持,发现具有良好的单滴喷射性能,没有卫星形成,并且液滴速度高达 8.25 m/s。通过在短通道氧化铟锡电极上打印单个 10 pL 油墨点,在 350°C 下进行 InO 煅烧和溶液处理的后通道保护,在底接触共面薄膜晶体管器件结构中证明了平均饱和迁移率约为 10 cm/(V s)。