高铜汞合金的研究。II. 在含30 wt%铜的镀汞高铜合金上的汞齐化过程

A study of high copper amalgams. II. Amalgamation on a Hg-plated high copper alloy containing 30 wt% Cu.

作者信息

Okabe T, Mitchell R, Wright A H, Fairhurst C W

出版信息

J Dent Res. 1978 Jul-Aug;57(7-8):768-71. doi: 10.1177/00220345780570070201.

DOI:10.1177/00220345780570070201

Abstract

The amalgamation reaction of a low silver, high copper alloy powder has been investigated by plating tablets of compacted powder with Hg. Both gamma1 Ag-Hg and micro Cu-Sn crystals form on the tablets. In spite of large differences in composition, these tablets amalgamated similarly to the T tablets studied and reported in Part I.

摘要

通过用汞镀压制粉末片，对低银、高铜合金粉末的汞齐化反应进行了研究。在这些片上形成了γ1银汞相和微小的铜锡晶体。尽管成分差异很大，但这些片的汞齐化过程与第一部分中研究和报道的T片类似。