A study of high copper amalgams. II. Amalgamation on a Hg-plated high copper alloy containing 30 wt% Cu.
作者信息
Okabe T, Mitchell R, Wright A H, Fairhurst C W
出版信息
J Dent Res. 1978 Jul-Aug;57(7-8):768-71. doi: 10.1177/00220345780570070201.
PMID:281348
Abstract
The amalgamation reaction of a low silver, high copper alloy powder has been investigated by plating tablets of compacted powder with Hg. Both gamma1 Ag-Hg and micro Cu-Sn crystals form on the tablets. In spite of large differences in composition, these tablets amalgamated similarly to the T tablets studied and reported in Part I.
摘要
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