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胶态组装和介电泳限制的 3D 成型。

Colloidal assembly and 3D shaping by dielectrophoretic confinement.

机构信息

Complex Materials, Department of Materials, ETH Zürich, Vladimir Prelog Weg 5, 8093, Zürich, Switzerland.

出版信息

Soft Matter. 2017 May 3;13(17):3182-3189. doi: 10.1039/c7sm00422b.

DOI:10.1039/c7sm00422b
PMID:28397927
Abstract

For decades, scientists and engineers have strived to design means of assembling colloids into ordered structures. By now, the literature is quite peppered with reports of colloidal assemblies. However, the available methods can assemble only a narrow range of structures or are applicable to specific types of colloids. There are still only few generic methods that would lead to arbitrary colloidal arrays or would shape colloidal assemblies into predesigned structures. Here, we first discuss in detail how to spatially control the assembly and crystallization of colloids through the balance of dielectrophoretic and dipolar forces. Furthermore, we demonstrate how to flexibly program and shape arrays of 3D microstructures that can be permanently affixed by in situ UV polymerization and calcination by using two facing similar or distinct micro-fabricated electrodes.

摘要

几十年来,科学家和工程师一直致力于设计将胶体组装成有序结构的方法。到目前为止,文献中已经有很多关于胶体组装的报道。然而,现有的方法只能组装很窄范围的结构,或者只适用于特定类型的胶体。目前只有少数通用方法可以导致任意胶体阵列,或者将胶体组装成预定结构。在这里,我们首先详细讨论如何通过介电泳和偶极子力的平衡来空间控制胶体的组装和结晶。此外,我们展示了如何通过使用两个相对的相似或不同的微加工电极来灵活地编程和塑造可以通过原位 UV 聚合和煅烧永久固定的 3D 微结构阵列。

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Colloidal assembly and 3D shaping by dielectrophoretic confinement.胶态组装和介电泳限制的 3D 成型。
Soft Matter. 2017 May 3;13(17):3182-3189. doi: 10.1039/c7sm00422b.
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