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含有硼、氮、铝、硅、磷和硫的三重掺杂单层石墨烯

Triple-Doped Monolayer Graphene with Boron, Nitrogen, Aluminum, Silicon, Phosphorus, and Sulfur.

作者信息

Ullah Saif, Denis Pablo A, Sato Fernando

机构信息

Departamento de Física, Instituto de Ciências Exatas, Campus Universitário, Universidade Federal de Juiz de Fora, Juiz de Fora, MG, 36036-900, Brazil.

Computational Nanotechnology, DETEMA, Facultad de Química, UDELAR, CC 1157, 11800, Montevideo, Uruguay), Fax: (+58) 9229241906.

出版信息

Chemphyschem. 2017 Jul 19;18(14):1864-1873. doi: 10.1002/cphc.201700278. Epub 2017 May 29.

Abstract

The structure, stability, electronic properties and chemical reactivity of X/B/N triple-doped graphene (TDG) systems (X=Al, Si, P, S) are investigated by means of periodic density functional calculations. In the studied TDGs the dopant atoms prefer to be bonded to one another instead of separated. In general, the XNB pattern is preferred, with the exception of sulfur, which favors the SBN motif. The introduction of a third dopant results in a negligible decrease of the cohesive energies with respect to the dual-doped graphene (DDG) counterparts. Thus, it is expect that these systems can be prepared soon. For SiNB TDG, the introduction of the B dopant reduces the gap opening at the K point and restores the Dirac cones that are destroyed in SiN DDG. On the contrary, for PNB TDG, the bandgap is increased with respect to PN DDG, probably because the introduction of B weakens the PN bonding, and thus the electronic structure is rather similar to that of P-doped graphene. Finally, with regard to the reactivity of the TDGs, for AlNB, PNB, and SNB the carbon atoms are more reactive than in their AlN, PN, and SN DDG counterparts. On the contrary, the reactivity of SiNB is lower than that of SiN DDG. Therefore, to increase the reactivity of graphene, Al, P, and S should be combined with BN motifs.

摘要

通过周期性密度泛函计算研究了X/B/N三掺杂石墨烯(TDG)体系(X = Al、Si、P、S)的结构、稳定性、电子性质和化学反应活性。在所研究的TDG中,掺杂原子倾向于相互键合而非分离。一般来说,除了硫倾向于SBN结构 motif外,XNB结构是优选的。相对于双掺杂石墨烯(DDG)对应物,引入第三种掺杂剂导致内聚能的降低可忽略不计。因此,预计这些体系很快就能制备出来。对于SiNB TDG,引入B掺杂剂会减小K点处的能隙开口,并恢复在SiN DDG中被破坏的狄拉克锥。相反,对于PNB TDG,相对于PN DDG,带隙增大,这可能是因为引入B削弱了PN键,因此电子结构与P掺杂石墨烯的电子结构相当相似。最后,关于TDG的反应活性,对于AlNB、PNB和SNB,碳原子比它们的AlN、PN和SN DDG对应物更具反应活性。相反,SiNB的反应活性低于SiN DDG。因此,为了提高石墨烯的反应活性,应将Al、P和S与BN结构 motif结合。

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