Department of Building, Civil and Environmental Engineering, Concordia University, 1455 de Maisonneuve Blvd. West, EV-6.139, Montreal, QC H3G 1M8, Canada.
Department of Building, Civil and Environmental Engineering, Concordia University, 1455 de Maisonneuve Blvd. West, EV-6.139, Montreal, QC H3G 1M8, Canada.
J Colloid Interface Sci. 2017 Sep 1;501:330-340. doi: 10.1016/j.jcis.2017.04.069. Epub 2017 Apr 24.
In this work, copper nanoparticles (CuNPs) were decorated onto the polyamide RO membranes via in-situ reduction for biofouling mitigation. To increase CuNPs loading and improve anti-microbial properties of the membrane, cysteamine (Cys) and graphene oxide (GO), which contain different functional groups with high metal affinity, were applied as bridging agents between CuNPs and membrane surface via covalent bonding. The functionalization of Cys and GO linkers on membrane was confirmed by XPS and SEM analysis. By applying the linkers, the loading quantity of copper, in particular on Cys-modified membrane, was significantly improved and the particle size of CuNPs appeared smaller and had more uniform distribution. The GO medium increased the hydrophilicity of CuNP-decorated membranes, leading to an increase in water permeation with minor impact on membrane's salt rejection. Bacterial inactivation of the Cys-Cu- and GO-Cu-functionalized membranes was over 25% higher than that of the bare CuNP-coated surface, indicating enhanced bacterial inactivation benefiting from the application of linkers. After a CuNPs' release test, the membranes modified with Cys and GO retained larger quantities of CuNPs and showed better antimicrobial performance than that of bare CuNP-modified membranes. The successful regeneration of CuNPs after their depletion demonstrated the modified membranes' potential for long-term application.
在这项工作中,通过原位还原在聚酰胺 RO 膜上修饰了铜纳米粒子(CuNPs)以减轻生物污垢。为了增加 CuNPs 的负载量并提高膜的抗微生物性能,使用含有高金属亲和力的不同官能团的半胱氨酸(Cys)和氧化石墨烯(GO)作为 CuNPs 和膜表面之间的桥联剂通过共价键结合。通过 XPS 和 SEM 分析证实了 Cys 和 GO 连接剂在膜上的功能化。通过应用这些连接剂,铜的负载量,特别是在 Cys 修饰的膜上,显著提高,并且 CuNPs 的粒径更小且分布更均匀。GO 介质增加了 CuNP 修饰膜的亲水性,导致水渗透率增加,对膜的盐截留率影响较小。Cys-Cu 和 GO-Cu 功能化膜的细菌失活率比裸 CuNP 涂层表面高 25%以上,表明由于连接剂的应用,细菌失活得到了增强。在 CuNPs 释放测试后,用 Cys 和 GO 修饰的膜保留了更多数量的 CuNPs,并表现出比裸 CuNP 修饰膜更好的抗菌性能。在耗尽后成功再生 CuNPs 表明修饰膜具有长期应用的潜力。