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材料中自修复剂的释放:接下来会发生什么?

Release of Self-Healing Agents in a Material: What Happens Next?

机构信息

Department of Mechanical and Industrial Engineering, University of Illinois at Chicago , 842 West Taylor Street, Chicago Illinois 60607-7022, United States.

School of Mechanical Engineering, Korea University , Seoul 136-713, Republic of Korea.

出版信息

ACS Appl Mater Interfaces. 2017 May 24;9(20):17449-17455. doi: 10.1021/acsami.7b03491. Epub 2017 May 15.

Abstract

A microfluidic chip-like setup consisting of a vascular system of microchannels alternatingly filled with either a resin monomer or a curing agent is used to study the intrinsic physical healing mechanism in self-healing materials. It is observed that, as a prenotched crack propagates across the chip, the resin and curing agent are released from the damaged channels. Subsequently, both the resin and the curing agent wet the surrounding polydimethylsiloxane (PDMS) matrix and spread over the crack banks until the two blobs come in contact, mix, and polymerize through an organometallic cross-linking reaction. Moreover, the polymerized domains form a system of pillars, which span the crack banks on the opposite side. This "stitching" phenomenon prevents further propagation of the crack.

摘要

采用一种类似微流控芯片的装置,该装置的血管系统由微通道交替填充树脂单体或固化剂组成,用于研究自修复材料中的固有物理愈合机制。结果表明,当预切口裂纹穿过芯片传播时,树脂和固化剂从受损通道中释放出来。随后,树脂和固化剂同时润湿周围的聚二甲基硅氧烷(PDMS)基质,并在裂纹两侧扩展,直到两个液滴接触、混合并通过有机金属交联反应聚合。此外,聚合区域形成了一个支柱系统,跨越相对侧的裂纹壁。这种“缝合”现象阻止了裂纹的进一步扩展。

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