Gerardo Carlos D, Cretu Edmond, Rohling Robert
Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, BC V6T 1Z4, Canada.
Department of Mechanical Engineering Department, University of British Columbia, Vancouver, BC V6T 1Z4, Canada.
Sensors (Basel). 2017 Jun 17;17(6):1420. doi: 10.3390/s17061420.
This article describes a new low-cost rapid microfabrication technology for high-density interconnects and passive devices on flexible substrates for sensing applications. Silver nanoparticles with an average size of 80 nm were used to create a conductive SU-8 mixture with a concentration of wt 25%. The patterned structures after hard baking have a sheet resistance of 11.17 Ω /□. This conductive SU-8 was used to pattern planar inductors, capacitors and interconnection lines on flexible Kapton film. The conductive SU-8 structures were used as a seed layer for a subsequent electroplating process to increase the conductivity of the devices. Examples of inductors, resistor-capacitor (RC) and inductor-capacitor (LC) circuits, interconnection lines and a near-field communication (NFC) antenna are presented as a demonstration. As an example of high-resolution miniaturization, we fabricated microinductors having line widths of 5 μ m. Mechanical bending tests were successful down to a 5 mm radius. To the best of the authors' knowledge, this is the first report of conductive SU-8 used to fabricate such planar devices and the first on flexible substrates. This is a proof of concept that this fabrication approach can be used as an alternative for microfabrication of planar passive devices on flexible substrates.
本文介绍了一种用于传感应用的柔性基板上高密度互连和无源器件的新型低成本快速微制造技术。使用平均尺寸为80nm的银纳米颗粒来制备浓度为25wt%的导电SU-8混合物。硬烘焙后的图案化结构的方块电阻为11.17Ω/□。这种导电SU-8用于在柔性聚酰亚胺薄膜上图案化平面电感器、电容器和互连线。导电SU-8结构用作后续电镀工艺的种子层，以提高器件的导电性。作为示例，展示了电感器、电阻-电容（RC）和电感-电容（LC）电路、互连线以及近场通信（NFC）天线。作为高分辨率小型化的一个例子，我们制造了线宽为5μm的微型电感器。机械弯曲测试在半径低至5mm时仍取得成功。据作者所知，这是关于使用导电SU-8制造此类平面器件的首次报道，也是在柔性基板上的首次报道。这证明了这种制造方法可作为柔性基板上平面无源器件微制造的一种替代方法。
