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SU-8 碳复合材料作为生物芯片应用的导电光致抗蚀剂。

SU-8-carbon composite as conductive photoresist for biochip applications.

机构信息

Laboratoire de Génie Enzymatique, Membranes Biomimétiques et Assemblages Supramoléculaires, Institut de Chimie et Biochimie Moléculaire et Supramoléculaire, Université Lyon1-CNRS 5246 ICBMS, Bât. CPE, 43 Bd du 11 Nov., 69622 Villeurbanne, France.

出版信息

Biosens Bioelectron. 2012 Oct-Dec;38(1):220-5. doi: 10.1016/j.bios.2012.05.026. Epub 2012 Jun 1.

Abstract

A composite photoresist has been developed for the direct photopatterning of electrodes useful as biochip substrates. The material is composed of SU-8 polymer added with graphite carbon filler which enables patterning of conductive thin films (22 μm) on both glass substrate and transparency flexible film with a standard UV photolithography protocol. The resolution obtained using the conductive composite compared well with the bare resist, with lateral resolutions of 5 and 10 μm for bare and conductive resists, respectively. The obtained electrodes, after an electrochemical pre-treatment, exhibited very good electrochemical behaviors, opening the path to various electrochemical detections and grafting possibilities. In order to demonstrate the potentialities of the developed material in the biosensors and biochips field, DNA probes were electrografted, using diazonium chemistry, directly at the composite photoresist surface. Target oligonucleotide interactions were detected using chemiluminescent labeling and a satisfactory detection limit of 0.25 nM target sequence was demonstrated with a detection ranging over three orders of magnitude.

摘要

已经开发出一种用于直接光图案化电极的复合光致抗蚀剂,这些电极可用作生物芯片基底。该材料由 SU-8 聚合物添加石墨碳填料组成,可使用标准的紫外光刻技术在玻璃基底和透明柔性薄膜上图案化导电薄膜(22 μm)。使用导电复合材料获得的分辨率与纯抗蚀剂相当,裸抗蚀剂和导电抗蚀剂的横向分辨率分别为 5 μm 和 10 μm。经过电化学预处理后,得到的电极表现出非常好的电化学行为,为各种电化学检测和接枝可能性开辟了道路。为了展示开发材料在生物传感器和生物芯片领域的潜力,使用重氮化学,直接在复合光致抗蚀剂表面电嫁接 DNA 探针。使用化学发光标记检测目标寡核苷酸相互作用,并证明目标序列的检测限低至 0.25 nM,检测范围超过三个数量级。

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