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基于砷化镓单片微波集成电路中双热流路径的n⁺ 砷化镓/金锗镍 - 金热电偶型射频微机电系统功率传感器。

n⁺ GaAs/AuGeNi-Au Thermocouple-Type RF MEMS Power Sensors Based on Dual Thermal Flow Paths in GaAs MMIC.

作者信息

Zhang Zhiqiang, Liao Xiaoping

机构信息

Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China.

出版信息

Sensors (Basel). 2017 Jun 17;17(6):1426. doi: 10.3390/s17061426.

DOI:10.3390/s17061426
PMID:28629144
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5492267/
Abstract

To achieve radio frequency (RF) power detection, gain control, and circuit protection, this paper presents n⁺ GaAs/AuGeNi-Au thermocouple-type RF microelectromechanical system (MEMS) power sensors based on dual thermal flow paths. The sensors utilize a conversion principle of RF power-heat-voltage, where a thermovoltage is obtained as the RF power changes. To improve the heat transfer efficiency and the sensitivity, structures of two heat conduction paths are designed: one in which a thermal slug of Au is placed between two load resistors and hot junctions of the thermocouples, and one in which a back cavity is fabricated by the MEMS technology to form a substrate membrane underneath the resistors and the hot junctions. The improved sensors were fabricated by a GaAs monolithic microwave integrated circuit (MMIC) process. Experiments show that these sensors have reflection losses of less than -17 dB up to 12 GHz. At 1, 5, and 10 GHz, measured sensitivities are about 63.45, 53.97, and 44.14 V/mW for the sensor with the thermal slug, and about 111.03, 94.79, and 79.04 V/mW for the sensor with the thermal slug and the back cavity, respectively.

摘要

为实现射频(RF)功率检测、增益控制和电路保护,本文提出了基于双热流路径的n⁺ 砷化镓/金锗镍 - 金热电偶型射频微机电系统(MEMS)功率传感器。这些传感器利用射频功率 - 热 - 电压的转换原理,在射频功率变化时获得热电压。为提高传热效率和灵敏度,设计了两种热传导路径结构:一种是在两个负载电阻和热电偶的热端之间放置金的热块;另一种是通过MEMS技术制造背腔,在电阻和热端下方形成衬底膜。改进后的传感器采用砷化镓单片微波集成电路(MMIC)工艺制造。实验表明,这些传感器在高达12 GHz的频率下反射损耗小于 -17 dB。对于带有热块的传感器,在1、5和10 GHz时测得的灵敏度分别约为63.45、53.97和44.14 V/mW;对于带有热块和背腔的传感器,在相同频率下测得的灵敏度分别约为111.03、94.79和79.04 V/mW。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/8702b8aeed71/sensors-17-01426-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/beec56efa6ae/sensors-17-01426-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/347d2b49abca/sensors-17-01426-g002a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/b34d3d396b1e/sensors-17-01426-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/8702b8aeed71/sensors-17-01426-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/beec56efa6ae/sensors-17-01426-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/347d2b49abca/sensors-17-01426-g002a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/b34d3d396b1e/sensors-17-01426-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2ca4/5492267/8702b8aeed71/sensors-17-01426-g004.jpg

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引用本文的文献

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本文引用的文献

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A 3D Model of the Thermoelectric Microwave Power Sensor by MEMS Technology.基于微机电系统(MEMS)技术的热电微波功率传感器的三维模型
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