Quantitative study of soldered connector tensile strength using low-gold content alloys.
作者信息
Janus C E, Beck D A, Moon P C
出版信息
J Prosthet Dent. 1985 Oct;54(4):517-21. doi: 10.1016/0022-3913(85)90424-x.
PMID:2864438
Abstract
摘要
相似文献
1
Quantitative study of soldered connector tensile strength using low-gold content alloys.使用低金含量合金对焊接连接器拉伸强度进行定量研究。
J Prosthet Dent. 1985 Oct;54(4):517-21. doi: 10.1016/0022-3913(85)90424-x.
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Structural investigations of the diffusion-zone of soldered dental gold and base metal alloys.牙科焊接金合金和贱金属合金扩散区的结构研究。
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[Fracture mechanics design of dental gold soldered joints (author's transl)].牙科金焊接接头的断裂力学设计（作者译）
Tandteknikern. 1981 Apr;50(4):181-203 contd.
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[Fracture mechanics design of dental gold soldered joints (author's transl)].牙科金焊接接头的断裂力学设计（作者译）
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Studies on microstructure of gold soldered joints.金焊接接头的微观结构研究。
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[Effects of different soldering gap spaces on tensile strength in soldered dental gold alloy (author's transl)].不同焊接间隙对牙科焊接金合金拉伸强度的影响（作者译）
Hiroshima Daigaku Shigaku Zasshi. 1977;9(2):265-9.
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Effect of gap distance on tensile strength of preceramic base metal solder joints.间隙距离对预陶瓷贱金属焊点拉伸强度的影响。
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