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金焊接接头的微观结构研究。

Studies on microstructure of gold soldered joints.

作者信息

Saito T, Fortunato Santos J

出版信息

J Dent Res. 1979 Mar;58(3):1108-14. doi: 10.1177/00220345790580031401.

Abstract

Solder microstructures were found to be influenced by those of the castings. A tendency of solder to match the microstructures contacted during its solidification was demonstrated. Several different types of defects were identified in the soldered joints. Tentative correlations of the observed microstructures and defects with physical properties, corrosion resistance and dimensional changes of soldered structures have been made.

摘要

发现焊料微观结构受铸件微观结构的影响。已证明焊料在凝固过程中有与所接触微观结构相匹配的趋势。在焊接接头中识别出几种不同类型的缺陷。已对观察到的微观结构和缺陷与焊接结构的物理性能、耐腐蚀性及尺寸变化进行了初步关联。

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