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光学声子在中间层介导的固体界面热输运中的作用。

The role of optical phonons in intermediate layer-mediated thermal transport across solid interfaces.

作者信息

Lee Eungkyu, Luo Tengfei

机构信息

Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA.

出版信息

Phys Chem Chem Phys. 2017 Jul 19;19(28):18407-18415. doi: 10.1039/c7cp02982a.

Abstract

Thermal transport across solid interfaces plays important roles in many applications, especially in the thermal management of modern power electronics. In this study, we use non-equilibrium MD (NEMD) simulations to systematically study a model SiC/GaN interface, which is an important interface in GaN-based power electronics, mated by different intermediate layers (ILs) with the focus on how the atomic masses of the ILs influence the overall thermal conductance. To isolate the mass effect, the Tersoff potential with the same parameters is used to approximate the interatomic interactions between all atoms, with the only differences between materials being their atomic masses. The NEMD results show that the thermal boundary conductance (TBC) of IL-mated interfaces depends not only on the total primitive cell mass of the IL but also on the relative masses of the atoms within the unit cell. By analyzing the vibrational power spectra (VPS) of SiC, IL, and GaN, it is found that the optical phonons play important roles in thermal transport across the solid/solid interfaces. There is an optimal mass ratio of the atoms in the unit cell of the IL that can maximize the overlap of IL optical phonon VPS with those of SiC and GaN. Furthermore, the atomic masses of a number of III-V semiconductor compounds are studied for the ILs. It is shown that when only considering the mass effect, in the classical limit, AlN will be the best IL to enhance thermal transport across SiC/GaN interfaces with an improvement of as much as 27% over that of a pristine SiC/GaN interface. Despite the known limitation of the model (e.g., absence of strain and quantum effects), the results from this work may still provide some useful information for the design of ILs to improve thermal transport across solid/solid interfaces.

摘要

固体界面间的热传输在许多应用中发挥着重要作用,尤其是在现代电力电子器件的热管理方面。在本研究中,我们使用非平衡分子动力学(NEMD)模拟系统地研究了一个模型SiC/GaN界面,该界面是基于GaN的电力电子器件中的一个重要界面,通过不同的中间层(ILs)进行匹配,重点关注ILs的原子质量如何影响整体热导率。为了分离质量效应,使用具有相同参数的Tersoff势来近似所有原子之间的原子间相互作用,材料之间的唯一区别在于它们的原子质量。NEMD结果表明,IL匹配界面的热边界电导(TBC)不仅取决于IL的总原胞质量,还取决于晶胞内原子的相对质量。通过分析SiC、IL和GaN的振动功率谱(VPS),发现光学声子在固体/固体界面间的热传输中起重要作用。IL晶胞中存在一个最佳原子质量比,可使IL光学声子VPS与SiC和GaN的VPS最大程度重叠。此外,还研究了多种用于ILs的III-V族半导体化合物的原子质量。结果表明,在经典极限下,仅考虑质量效应时,AlN将是增强SiC/GaN界面间热传输的最佳IL,与原始SiC/GaN界面相比,热导率提高多达27%。尽管该模型存在已知局限性(例如,不存在应变和量子效应),但这项工作的结果仍可能为设计ILs以改善固体/固体界面间的热传输提供一些有用信息。

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