• 文献检索
  • 文档翻译
  • 深度研究
  • 学术资讯
  • Suppr Zotero 插件Zotero 插件
  • 邀请有礼
  • 套餐&价格
  • 历史记录
应用&插件
Suppr Zotero 插件Zotero 插件浏览器插件Mac 客户端Windows 客户端微信小程序
定价
高级版会员购买积分包购买API积分包
服务
文献检索文档翻译深度研究API 文档MCP 服务
关于我们
关于 Suppr公司介绍联系我们用户协议隐私条款
关注我们

Suppr 超能文献

核心技术专利：CN118964589B侵权必究
粤ICP备2023148730 号-1Suppr @ 2026

文献检索

告别复杂PubMed语法，用中文像聊天一样搜索，搜遍4000万医学文献。AI智能推荐，让科研检索更轻松。

立即免费搜索

文件翻译

保留排版，准确专业，支持PDF/Word/PPT等文件格式，支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述，25分钟生成高质量综述，智能提取关键信息，辅助科研写作。

立即免费体验

在聚光硅太阳能电池焊料层的Sn3.0Ag0.5Cu/Cu互连中析出的Cu₆Sn₅晶须

Cu₆Sn₅ Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.

作者信息

Zhang Liang, Liu Zhi-Quan, Yang Fan, Zhong Su-Juan

机构信息

School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116, China.

Institute of Metal Research, Chinese Academy of Science, Shenyang 110016, China.

出版信息

Materials (Basel). 2017 Mar 23;10(4):327. doi: 10.3390/ma10040327.

DOI:10.3390/ma10040327
PMID:28772686
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5506998/
Abstract

Cu₆Sn₅ whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag₃Sn fibers can be observed around Cu₆Sn₅ whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu₆Sn₅ whiskers can be observed, and hexagonal rod structure is the main morphology of Cu₆Sn₅ whiskers. A hollow structure can be observed in hexagonal Cu₆Sn₅ whiskers, and a screw dislocation mechanism was used to represent the Cu₆Sn₅ growth. Based on mechanical property testing and finite element simulation, Cu₆Sn₅ whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.

摘要

在聚光硅太阳能电池焊料层的Sn3.0Ag0.5Cu/Cu互连中发现了Cu₆Sn₅晶须，并在回流焊接后和老化过程中对其进行了研究。在基体微观结构中，可以观察到Ag₃Sn纤维围绕在Cu₆Sn₅晶须周围，这对互连的可靠性可能起到积极作用。可以观察到Cu₆Sn₅晶须的不同形态，六方棒状结构是Cu₆Sn₅晶须的主要形态。在六方Cu₆Sn₅晶须中可以观察到中空结构，并采用螺位错机制来描述Cu₆Sn₅的生长。基于力学性能测试和有限元模拟，认为Cu₆Sn₅晶须对聚光硅太阳能电池焊料层中Sn3.0Ag0.5Cu/Cu互连的耐久性有负面影响。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/d550162e32cc/materials-10-00327-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/56e5975d3173/materials-10-00327-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/1003712e4655/materials-10-00327-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/c508d9cc3dc7/materials-10-00327-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/a6a2a9d91434/materials-10-00327-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/5f3d399332cb/materials-10-00327-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/cd4edb37b76e/materials-10-00327-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/b124f8e692d8/materials-10-00327-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/d550162e32cc/materials-10-00327-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/56e5975d3173/materials-10-00327-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/1003712e4655/materials-10-00327-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/c508d9cc3dc7/materials-10-00327-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/a6a2a9d91434/materials-10-00327-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/5f3d399332cb/materials-10-00327-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/cd4edb37b76e/materials-10-00327-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/b124f8e692d8/materials-10-00327-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e076/5506998/d550162e32cc/materials-10-00327-g008.jpg

相似文献

1
Cu₆Sn₅ Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.在聚光硅太阳能电池焊料层的Sn3.0Ag0.5Cu/Cu互连中析出的Cu₆Sn₅晶须
Materials (Basel). 2017 Mar 23;10(4):327. doi: 10.3390/ma10040327.
2
Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints.钼纳米颗粒对Sn3.0Ag0.5Cu/Cu焊点中金属间化合物层生长行为的影响
J Nanosci Nanotechnol. 2020 Apr 1;20(4):2573-2577. doi: 10.1166/jnn.2020.17203.
3
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.锡铋焊点的界面反应与力学性能
Materials (Basel). 2017 Aug 9;10(8):920. doi: 10.3390/ma10080920.
4
Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition.添加微量铝的Sn-1.0Ag-0.5Cu焊料的焊接特性及力学性能
Materials (Basel). 2016 Jun 28;9(7):522. doi: 10.3390/ma9070522.
5
Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation.基于热-机械耦合仿真的绝缘栅双极型晶体管模块焊接特性研究
Materials (Basel). 2023 May 2;16(9):3504. doi: 10.3390/ma16093504.
6
Metal deposited nanoparticles as "bridge materials" for lead-free solder nanocomposites.作为无铅焊料纳米复合材料“桥梁材料”的金属沉积纳米颗粒。
Appl Nanosci. 2023;13(12):7387-7397. doi: 10.1007/s13204-023-02898-z. Epub 2023 Jul 7.
7
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.添加高岭土地聚合物陶瓷对Sn-3.0Ag-0.5Cu焊点在多次回流过程中的微观结构和剪切强度的影响。
Materials (Basel). 2022 Apr 8;15(8):2758. doi: 10.3390/ma15082758.
8
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.采用层层转移石墨烯控制无铅焊点界面的界面反应和金属间化合物生长。
ACS Appl Mater Interfaces. 2016 Mar 2;8(8):5679-86. doi: 10.1021/acsami.5b11903. Epub 2016 Feb 22.
9
Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint.成像焊点中单个Cu₆Sn₅晶粒的多晶型转变。
Materials (Basel). 2018 Nov 9;11(11):2229. doi: 10.3390/ma11112229.
10
The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-Sb High-Temperature Lead-Free Solder.Sn-3.0Ag-0.5Cu-Sb高温无铅焊料的微观结构、热性能和力学性能
Materials (Basel). 2020 Oct 7;13(19):4443. doi: 10.3390/ma13194443.

引用本文的文献

1
Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films.具有电沉积Sn-Zn合金薄膜的钎焊铜棒的力学性能
Materials (Basel). 2020 Mar 14;13(6):1330. doi: 10.3390/ma13061330.