Xiao Kui, Yi Pan, Yan Lidan, Bai Ziheng, Dong Chaofang, Dong Pengfei, Gao Xiong
Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China.
Materials (Basel). 2017 Jul 6;10(7):762. doi: 10.3390/ma10070762.
The electrochemical corrosion behavior of a silver-plated circuit board (PCB-ImAg) in a polluted marine atmosphere environment (Qingdao in China) is studied through a simulated experiment. The morphologies of PCB-ImAg show some micropores on the surface that act as the corrosion-active points in the tests. Cl mainly induces microporous corrosion, whereas SO₂ causes general corrosion. Notably, the silver color changes significantly under SO₂ influence. EIS results show that the initial charge transfer resistance in the test containing SO₂ and Cl is 9.847 × 10³, while it is 3.701 × 10⁴ in the test containing Cl only, which demonstrates that corrosion accelerates in a mixed atmosphere. Polarization curves further show that corrosion potential is lower in mixed solutions (between -0.397 V SCE and -0.214 V SCE) than it in the solution containing Cl only (-0.168 V SCE), indicating that corrosion tendency increases with increased HSO₃ concentration.
通过模拟实验研究了镀银电路板（PCB-ImAg）在中国青岛污染海洋大气环境中的电化学腐蚀行为。PCB-ImAg的形貌表明其表面存在一些微孔，这些微孔在测试中充当腐蚀活性点。Cl主要引发微孔腐蚀，而SO₂导致全面腐蚀。值得注意的是，在SO₂的影响下，银的颜色发生了显著变化。电化学阻抗谱（EIS）结果表明，含有SO₂和Cl的测试中初始电荷转移电阻为9.847×10³，而仅含Cl的测试中为3.701×10⁴，这表明在混合气氛中腐蚀加速。极化曲线进一步表明，混合溶液中的腐蚀电位（在-0.397 V SCE和-0.214 V SCE之间）低于仅含Cl的溶液中的腐蚀电位（-0.168 V SCE），表明腐蚀倾向随HSO₃浓度的增加而增大。
