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电子材料与器件的腐蚀。

Corrosion of electronic materials and devices.

出版信息

Science. 1986 Oct 17;234(4774):340-5. doi: 10.1126/science.234.4774.340.

DOI:10.1126/science.234.4774.340
PMID:17834532
Abstract

Electronic materials and devices corrode in the same ways as automobiles, bridges, and pipelines, but their typically small dimensions make them orders of magnitude more susceptible to corrosion failure. As elsewhere, the corrosion involves interactions with the environment. Under control, these interactions can be put to use, as in the formation of protective and functional oxide films for superconducting devices. Otherwise, they cause damage, as in the electrolytic dissolution of conductors, even gold, in the presence of humidity and ionic contamination from atmospheric particles and gases. Preventing corrosion entails identifying the damaging interactions and excluding species that allow them to occur.

摘要

电子材料和器件的腐蚀方式与汽车、桥梁和管道相同,但由于其通常较小的尺寸,它们更容易受到腐蚀失效的影响。在其他地方也是如此,腐蚀涉及与环境的相互作用。在控制条件下,这些相互作用可以被利用,例如在超导器件中形成保护性和功能性氧化物薄膜。否则,它们会造成损坏,例如在湿度存在以及大气颗粒和气体中的离子污染的情况下,导体(甚至是金)的电解溶解。防止腐蚀需要识别出破坏性的相互作用,并排除允许它们发生的物质。

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