Department of Materials Science and Engineering, College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics , Nanjing 211106, P. R. China.
College of Materials Science and Technology, Nanjing University of Aeronautics & Astronautics , 29 Yudao Street, Nanjing 210016, P. R. China.
ACS Appl Mater Interfaces. 2017 Aug 30;9(34):28887-28901. doi: 10.1021/acsami.7b07785. Epub 2017 Aug 16.
Sustainability urgently demands low dielectric loss and low elastic modulus as fostering high permittivity (Hi-K) conductor/polymer composites. This work introduces a ternary composite system, consisting of acrylic resin elastomer (AR), chemically modified polyaniline (HBSiPA), and the thermally reduced graphene oxides (TrGOs), for applying to actuators, of which AR was fabricated by free radical polymerization. The unique hybridized graphene (HBSiPA-TrGO) was prepared by a two-step procedure, including the doped polyaniline modified by the hyperbranched polysiloxane via a ring opening reaction, followed by the decoration of HBSiPA on the surface of TrGO, the conductivity of which is desired to be the same as that of graphene. Afterward, diverse filler contents of HBSiPA-TrGO were put into the AR matrix to fabricate composites with the solution casting method and TrGO/AR composites were fabricated as well for comparison. Unlike TrGO, HBSiPA has plenty of polyaniline chain segments that ensure better dispersion of graphene hybrids in the AR, and thus the composites inherit the excellent electrical property of graphene. The permittivity and dielectric loss of the HBSiPA-TrGO/AR composite at 100 Hz are 3.5 and 0.27 times that of the TrGO/AR composite, respectively, when the loading of fillers approaches the percolation threshold (f), which originates from the HBSiPA anchored onto the graphene serving as spacer and thus decreases the leakage currents induced by the contact of graphene sheets. Besides, the elastic modulus of 2.83 vol % HBSiPA-TrGO/AR composite was lower than 5 MPa.
可持续性迫切需要低介电损耗和低弹性模量,以培育高介电常数(高 K)导体/聚合物复合材料。本工作介绍了一种三元复合体系,由丙烯酸酯弹性体(AR)、化学改性聚苯胺(HBSiPA)和热还原氧化石墨烯(TrGO)组成,适用于驱动器,其中 AR 通过自由基聚合制备。独特的杂化石墨烯(HBSiPA-TrGO)通过两步法制备,包括通过开环反应用超支化聚硅氧烷改性的掺杂聚苯胺,然后在 TrGO 表面修饰 HBSiPA,其电导率与石墨烯相同。随后,将不同含量的 HBSiPA-TrGO 填充到 AR 基质中,通过溶液浇铸法制备复合材料,并制备了 TrGO/AR 复合材料作为比较。与 TrGO 不同,HBSiPA 具有大量的聚苯胺链段,可确保石墨烯杂化物在 AR 中的更好分散,从而使复合材料继承了石墨烯的优异电性能。当填充量接近渗流阈值(f)时,HBSiPA-TrGO/AR 复合材料在 100 Hz 时的介电常数和介电损耗分别是 TrGO/AR 复合材料的 3.5 倍和 0.27 倍,这源于固定在石墨烯上的 HBSiPA 作为间隔物,从而减少了由石墨烯片接触引起的漏电流。此外,2.83 体积% HBSiPA-TrGO/AR 复合材料的弹性模量低于 5 MPa。