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具有高灵敏度和抗过载能力的压力传感器刚度突变结构的应用与优化

Application and Optimization of Stiffness Abruption Structures for Pressure Sensors with High Sensitivity and Anti-Overload Ability.

作者信息

Xu Tingzhong, Lu Dejiang, Zhao Libo, Jiang Zhuangde, Wang Hongyan, Guo Xin, Li Zhikang, Zhou Xiangyang, Zhao Yulong

机构信息

State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of SuzhouNano Science and Technology, School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China.

School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW 2052, Australia.

出版信息

Sensors (Basel). 2017 Aug 26;17(9):1965. doi: 10.3390/s17091965.

Abstract

The influence of diaphragm bending stiffness distribution on the stress concentration characteristics of a pressure sensing chip had been analyzed and discussed systematically. According to the analysis, a novel peninsula-island-based diaphragm structure was presented and applied to two differenet diaphragm shapes as sensing chips for pressure sensors. By well-designed bending stiffness distribution of the diaphragm, the elastic potential energy induced by diaphragm deformation was concentrated above the gap position, which remarkably increased the sensitivity of the sensing chip. An optimization method and the distribution pattern of the peninsula-island based diaphragm structure were also discussed. Two kinds of sensing chips combined with the peninsula-island structures distributing along the side edge and diagonal directions of rectangular diaphragm were fabricated and analyzed. By bonding the sensing chips with anti-overload glass bases, these two sensing chips were demonstrated by testing to achieve not only high sensitivity, but also good anti-overload ability. The experimental results showed that the proposed structures had the potential to measure ultra-low absolute pressures with high sensitivity and good anti-overload ability in an atmospheric environment.

摘要

系统地分析和讨论了膜片弯曲刚度分布对压力传感芯片应力集中特性的影响。根据分析结果,提出了一种基于半岛 - 岛屿的新型膜片结构,并将其应用于两种不同形状的膜片作为压力传感器的传感芯片。通过精心设计膜片的弯曲刚度分布,使膜片变形引起的弹性势能集中在间隙位置上方,显著提高了传感芯片的灵敏度。还讨论了基于半岛 - 岛屿的膜片结构的优化方法和分布模式。制作并分析了两种与沿矩形膜片侧边和对角线方向分布的半岛 - 岛屿结构相结合的传感芯片。通过将传感芯片与抗过载玻璃基底键合,经测试表明这两种传感芯片不仅具有高灵敏度,而且具有良好的抗过载能力。实验结果表明,所提出的结构有潜力在大气环境中以高灵敏度和良好的抗过载能力测量超低绝对压力。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d85a/5621370/dc25d1a65ad2/sensors-17-01965-g029.jpg

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