Brianezzi Leticia Ferreira de Freitas, Maenosono Rafael Massunari, Bim Odair, Zabeu Giovanna Speranza, Palma-Dibb Regina Guenka, Ishikiriama Sérgio Kiyoshi
Universidade de São Paulo, Faculdade de Odontologia de Bauru, Departamento de Dentística, Endodontia e Materiais Odontológicos, Bauru, SP, Brasil.
Universidade de São Paulo, Faculdade de Odontologia de Ribeirão Preto, Departamento de Odontologia Restauradora, Ribeirão Preto, SP, Brasil.
J Appl Oral Sci. 2017 Jul-Aug;25(4):381-386. doi: 10.1590/1678-7757-2016-0461.
This study aimed to investigate the effect of laser diode irradiation on the degree of conversion (DC), water sorption (WS), and water solubility (WSB) of these bonding systems in an attempt to improve their physico-mechanical resistance.
Two bonding agents were tested: a two-step total-etch system [Adper™ Single Bond 2, 3M ESPE (SB)] and a universal system [Adper™ Single Bond Universal, 3M ESPE (SU)]. Square-shaped specimens were prepared and assigned into 4 groups (n=5): SB and SU (control groups - no laser irradiation) and SB-L and SU-L [SB and SU laser (L) - irradiated groups]. DC was assessed using Fourier transform infrared spectroscopy with attenuated total reflectance. Additional uncured resin samples (≈3.0 µL, n=5) of each adhesive were also scanned for final DC calculation. For WS/WSB tests, similar specimens (n=10) were prepared and measured by monitoring the mass changes after dehydration/water storage cycles. For both tests, adhesive fluids were dropped into standardized Teflon molds (6.0×6.0×1.0 mm), irradiated with a 970-nm laser diode, and then polymerized with an LED-curing unit (1 W/cm2).
Laser irradiation immediately before photopolymerization increased the DC (%) of the tested adhesives: SB-L>SB>SU-L>SU. For WS/WSB (μg/mm3), only the dentin bonding system (DBS) was a significant factor (p<0.05): SB>SU.
Irradiation with a laser diode improved the degree of conversion of all tested simplified dentin bonding systems, with no impact on water sorption and solubility.
本研究旨在探究激光二极管照射对这些粘结系统的转化率（DC）、吸水率（WS）和水溶性（WSB）的影响，以提高其物理机械性能。
测试了两种粘结剂：两步全蚀刻系统[Adper™单组分粘结剂2，3M ESPE（SB）]和通用系统[Adper™单组分通用粘结剂，3M ESPE（SU）]。制备方形试件并分为4组（n = 5）：SB和SU（对照组 - 无激光照射）以及SB-L和SU-L[SB和SU激光（L）照射组]。使用衰减全反射傅里叶变换红外光谱法评估DC。还对每种粘结剂的额外未固化树脂样品（约3.0μL，n = 5）进行扫描，以进行最终DC计算。对于WS/WSB测试，制备类似的试件（n = 10），并通过监测脱水/水储存循环后的质量变化进行测量。对于这两种测试，将粘结剂液体滴入标准化的聚四氟乙烯模具（6.0×6.0×1.0 mm）中，用970 nm激光二极管照射，然后用LED固化单元（1 W/cm²）聚合。
光聚合前立即进行激光照射可提高测试粘结剂的DC（%）：SB-L>SB>SU-L>SU。对于WS/WSB（μg/mm³），只有牙本质粘结系统（DBS）是一个显著因素（p<0.05）：SB>SU。
激光二极管照射提高了所有测试的简化牙本质粘结系统的转化率，且对吸水率和溶解性无影响。
