Memon Muhammad Usman, Lim Sungjoon
School of Electrical and Electronics Engineering, College of Engineering, Chung-Ang University, 221 Heukseok-dong, Dongjak-gu, Seoul 156-756, Korea.
Sensors (Basel). 2017 Sep 9;17(9):2068. doi: 10.3390/s17092068.
The significant improvements observed in the field of bulk-production of printed microchip technologies in the past decade have allowed the fabrication of microchip printing on numerous materials including organic and flexible substrates. Printed sensors and electronics are of significant interest owing to the fast and low-cost fabrication techniques used in their fabrication. The increasing amount of research and deployment of specially printed electronic sensors in a number of applications demonstrates the immense attention paid by researchers to this topic in the pursuit of achieving wider-scale electronics on different dielectric materials. Although there are many traditional methods for fabricating radio frequency (RF) components, they are time-consuming, expensive, complicated, and require more power for operation than additive fabrication methods. This paper serves as a summary/review of improvements made to the additive printing technologies. The article focuses on three recently developed printing methods for the fabrication of wireless sensors operating at microwave frequencies. The fabrication methods discussed include inkjet printing, three-dimensional (3D) printing, and screen printing.
在过去十年中,印刷微芯片技术的批量生产领域取得了显著进步,这使得在包括有机和柔性基板在内的多种材料上制造微芯片印刷成为可能。由于印刷传感器和电子产品的制造采用了快速且低成本的制造技术,因此它们备受关注。在许多应用中,专门印刷的电子传感器的研究和部署数量不断增加,这表明研究人员在追求在不同介电材料上实现更广泛规模的电子产品时,对该主题给予了极大关注。尽管有许多制造射频(RF)组件的传统方法,但它们耗时、昂贵、复杂,并且与增材制造方法相比,运行所需的功率更大。本文对增材印刷技术的改进进行了总结/综述。文章重点介绍了最近开发的三种用于制造工作在微波频率的无线传感器的印刷方法。所讨论的制造方法包括喷墨印刷、三维(3D)印刷和丝网印刷。