Sugawara Shigeru, Nakayama Yoshihiko, Taniguchi Hideya, Ishimaru Ichiro
National Research Institute of Police Science, Kashiwa, Japan.
Aoi Electronics co., ltd., Takamatsu, Japan.
Sci Rep. 2017 Sep 29;7(1):12395. doi: 10.1038/s41598-017-11994-4.
By combining a bolometer detector with an imaging-type interferometer, an inexpensive, easy-to-handle wide-field mid-infrared hyperspectral imaging apparatus was produced. We measured the distributions of four types of thin adhesive layers on an aluminium plate and analysed the results using correlation coefficients to visualise the distribution of various adhesives that cannot be discerned by the naked eye or conventional methods such as visible/near-infrared spectroscopic/fluorescent photography. The measurement wavelength range, obtained spectrum's wavenumber resolution, and measurement time was 8-14 μm, about 9 cm, and about 30 s, respectively. Using conventional methods, adhesives could not be distinguished from the others. By using this method, we found that adhesives could be precisely distinguished by setting an appropriate threshold value for the correlation coefficient. Thus, our approach can accurately measure the spatial distribution of different types of adhesive that cannot be discriminated by conventional methods.
通过将测辐射热计探测器与成像型干涉仪相结合，制造出了一种价格低廉、易于操作的宽场中红外高光谱成像设备。我们测量了铝板上四种类型薄粘合剂层的分布，并使用相关系数对结果进行分析，以可视化各种用肉眼或传统方法（如可见/近红外光谱/荧光摄影）无法辨别的粘合剂的分布。测量波长范围、所得光谱的波数分辨率和测量时间分别为8 - 14μm、约9cm和约30秒。使用传统方法无法区分粘合剂。通过使用这种方法，我们发现通过为相关系数设置适当的阈值，可以精确区分粘合剂。因此，我们的方法可以准确测量传统方法无法辨别的不同类型粘合剂的空间分布。
