Hisatsune K
Shika Rikogaku Zasshi. 1979 Apr;20(50):111-4.
The order-hardening and its modes of equiatomic alloy CuPt were investigated by means of hardness test, X-ray diffraction and optical microscopic observations. The important results obtained are as follows; (1) Two different modes of order-hardening are recognized, namely at the temperature ranges of 400 degrees C-550 degrees C and 600 degrees C-700 degrees C. (2) The activation energies for order-hardening at lower and higher temperatures are 19.3 and 31.1 kcal/mol, respectively. The former corresponds to the migration and the annihilation of quenched-in excess vacancies, the latter corresponding to the growth of ordered domain. (3) Heterogeneous ordering along the grain boundary at lower temperature and homogeneous ordering within the grain at higher temperature are the dominant reaction for hardening. But the ordering is achieved by the nucleation-and-growth process at all temperature.
通过硬度测试、X射线衍射和光学显微镜观察，对等原子合金CuPt的有序硬化及其模式进行了研究。获得的重要结果如下：(1) 识别出两种不同的有序硬化模式，即在400℃ - 550℃和600℃ - 700℃温度范围内。(2) 较低温度和较高温度下有序硬化的激活能分别为19.3和31.1千卡/摩尔。前者对应于淬火过量空位的迁移和湮灭，后者对应于有序畴晶的生长。(3) 较低温度下沿晶界的非均匀有序化和较高温度下晶粒内的均匀有序化是硬化的主要反应。但在所有温度下，有序化都是通过形核生长过程实现的。
