Hisatsune K
Shika Rikogaku Zasshi. 1979 Apr;20(50):104-10.
Isothermal ordering processes of equiatomic alloy CuPt quenched from above the critical temperature were investigated by means of electrical resistivity measurements, X-ray diffraction and electron microscopic observations. The main results obtained are as follows; (1) two different orderings are recognized at above and below 560 degrees C. Each main reaction is an ordering process having the activation energies of 30.6 and 17.4 kcal/mol, respectively. (2) In the early stage of ordering at the temperature below 200 degrees C the growth of disperse order is recognized by the increment of electrical resistivity, and has an activation energy of 30.1 kcal/mol. (3) At the temperature between 300 degrees C and 560 degrees C, the process of ordering consists of three stages having an activation energy of 17.4, 23.6 and 65.3 kcal/mol, respectively. These correspond to the ordering processes by the migration and the annihilation of quenched-in excess vacancies, the annihilation of secondary defects and the diffusion of equilibrium vacancies, respectively. (4) At the temperature above 560 degrees C, the process of ordering consists of two stages. The bulk of the ordering is a homogenous ordering within the grain.
通过电阻率测量、X射线衍射和电子显微镜观察，研究了从临界温度以上淬火的等原子合金CuPt的等温有序化过程。获得的主要结果如下：（1）在560℃以上和以下识别出两种不同的有序化。每个主要反应都是一个有序化过程，其活化能分别为30.6和17.4千卡/摩尔。（2）在低于200℃的温度下有序化的早期阶段，通过电阻率的增加可以识别出弥散有序化的增长，其活化能为30.1千卡/摩尔。（3）在300℃至560℃之间的温度下，有序化过程由三个阶段组成，其活化能分别为17.4、23.6和65.3千卡/摩尔。这些分别对应于通过淬火过量空位的迁移和湮灭、二次缺陷的湮灭以及平衡空位的扩散进行的有序化过程。（4）在560℃以上的温度下，有序化过程由两个阶段组成。大部分有序化是晶粒内的均匀有序化。
