Department of Materials Science and Engineering, The University of Texas at Dallas, 800 W. Campbell Road, Richardson, TX, 75080-3021, USA.
Department of Mechanical Engineering, The University of Texas at Dallas, 800 W. Campbell Road, Richardson, TX, 75080-3021, USA.
Adv Mater. 2018 Mar;30(11). doi: 10.1002/adma.201706733. Epub 2018 Jan 22.
A batch-assembly technique for forming 3D electronics on shape memory polymer substrates is demonstrated and is used to create dense, highly sensitive, multimodal arrays of electronic whiskers. Directed air flow at temperatures above the substrate's glass transition temperature transforms planar photolithographically defined resistive sensors from 2D precursors into shape-tunable, deterministic 3D assemblies. Reversible 3D assembly and flattening is achieved by exploiting the shape memory properties of the substrate, enabling context-driven shape reconfiguration to isolate/enhance specific sensing modes. In particular, measurement schemes and device configurations are introduced that allow for the sensing of temperature, stiffness, contact force, proximity, and surface texture and roughness. The assemblies offer highly spatiotemporally resolved, wide-range measurements of surface topology (50 nm to 500 µm), material stiffness (200 kPa to 7.5 GPa), and temperature (0-100 °C), with response times of <250 µs. The development of a scalable process for 3D assembly of reconfigurable electronic sensors, as well as the large breadth and sensitivity of complex sensing modes demonstrated, has applications in the growing fields of 3D assembly, electronic skin, and human-machine interfaces.
一种用于在形状记忆聚合物衬底上形成 3D 电子器件的批处理组装技术得到了展示，并用于创建密集、高灵敏度、多模式的电子须状阵列。高于基底玻璃化转变温度的定向气流将平面光刻定义的电阻传感器从 2D 前体转变为形状可调、确定性的 3D 组件。通过利用基底的形状记忆特性实现可逆的 3D 组装和平整化，从而能够实现上下文驱动的形状重构，以隔离/增强特定的传感模式。特别是，引入了测量方案和器件配置，允许对温度、刚度、接触力、接近度以及表面纹理和粗糙度进行传感。这些组件提供了高度时空分辨率、宽范围的表面拓扑（50nm 至 500µm）、材料刚度（200kPa 至 7.5GPa）和温度（0-100°C）的测量，响应时间小于 250µs。这种可重构电子传感器的 3D 组装的可扩展工艺的发展以及所展示的复杂传感模式的广泛应用和灵敏度，在 3D 组装、电子皮肤和人机界面等快速发展的领域具有应用前景。
