氮化硼纳米片增强聚酰亚胺复合材料的导热性能。
Enhanced Thermal Conductivity of Polyimide Composites with Boron Nitride Nanosheets.
机构信息
Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.
College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou, 310018, China.
出版信息
Sci Rep. 2018 Jan 24;8(1):1557. doi: 10.1038/s41598-018-19945-3.
A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44 W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.
一种通过熔融氢氧化物辅助液相剥离六方氮化硼（h-BN）粉末制备氮化硼纳米片（BNNSs）的策略被报道。通过一种简单、低成本且可扩展的剥离方法，获得了平均厚度为 3nm 的 BNNSs。通过溶液浇铸工艺制备了具有 BNNSs 填料的高热导率聚酰亚胺（PI）复合薄膜。具有 7wt% BNNSs 的 PI 复合薄膜的面内热导率高达 2.95W/mK，与纯 PI 相比增加了 1080%。相比之下，复合材料的平面外热导率仅增加了 76%，为 0.44W/mK。证实高热导率各向异性归因于 BNNSs 的高度取向。PI/BNNSs 复合薄膜在下一代电子设备领域的热管理应用中具有吸引力。
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