碳化硅纳米线填充环氧树脂复合材料的导热性能增强。
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires.
机构信息
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China.
Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.
出版信息
Sci Rep. 2017 Jun 1;7(1):2606. doi: 10.1038/s41598-017-02929-0.
In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm K, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.
在这项研究中，我们报告了一种制备环氧复合材料的简便方法，该复合材料中掺入了碳化硅纳米线（SiC NWs）。我们彻底研究了环氧/SiC NWs 复合材料的热导率。与纯环氧树脂相比，填充 3.0wt%填料的环氧/SiC NWs 复合材料的热导率达到 0.449WmK，约提高了 106%。相比之下，相同质量分数的硅碳化硅微米颗粒（SiC MPs）掺入到环氧树脂基体中对热传导性能的改善较小。这归因于 SiC NWs 之间形成了有效的热传导途径以及纳米线与环氧树脂基体之间的强相互作用。此外，环氧/SiC NWs 复合材料的热性能也得到了提高。这些结果表明，我们开发了一种增强聚合物复合材料热导率的新方法，满足了电子设备快速发展的要求。
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