填充改性六方氮化硼和纳米金刚石混合填料的聚酰亚胺复合材料的热导率增强

Enhanced Thermal Conductivity of Polyimide Composites Filled with Modified -BN and Nanodiamond Hybrid Filler.

作者信息

Yang Xi, Yu Xiaoyan, Naito Kimiyoshi, Ding Huili, Qu Xiongwei, Zhang Qingxin

机构信息

Institute of Polymer Science and Engineering, School of Chemical Engineering and Technology, Hebei University of Technology, Tianjin 300130, China.

Hybrid Material Center, National Institute for Materials Science (NIMS), Tsukuba 3050047, Japan.

出版信息

J Nanosci Nanotechnol. 2018 May 1;18(5):3291-3298. doi: 10.1166/jnn.2018.14630.

DOI:10.1166/jnn.2018.14630

PMID:29442830

Abstract

A new thermally conductive and electrically insulative polyimide were prepared by filling different amounts of hexagonal boron nitride (h-BN) particles, and the thermal conductivity of Polyimide (PI) composites were improved with the increasing h-BN content. Based on this, two methods were applied to improve thermal conductivity furtherly at limited filler loading in this paper. One is modifying the h-BN to improve interface interaction, another is fabricating a nano-micro hybrid filler with 2-D h-BN and 0-D nano-scale nanodiamond (ND) to build more effective conductive network. Both surface modification and hybrid system have a positive effect on thermal conductivity. The composites introducing 40 wt% hybrid filler (the weight ratio of ND/modified BN was 1/10) showed the highest thermal conductivity, being up to 0.98 W/(m K) (5.2 times that of PI). In addition, the composites exhibits excellent electrical insulation, thermal stability properties etc.

摘要

通过填充不同含量的六方氮化硼（h-BN）颗粒制备了一种新型的导热绝缘聚酰亚胺，聚酰亚胺（PI）复合材料的热导率随着h-BN含量的增加而提高。基于此，本文采用两种方法在有限的填料负载量下进一步提高热导率。一种是对h-BN进行改性以改善界面相互作用，另一种是制备由二维h-BN和零维纳米级纳米金刚石（ND）组成的纳米-微米混合填料以构建更有效的导电网络。表面改性和混合体系对热导率均有积极影响。引入40 wt%混合填料（ND/改性BN的重量比为1/10）的复合材料表现出最高的热导率，高达0.98 W/(m·K)（是PI的5.2倍）。此外，该复合材料还具有优异的电绝缘性、热稳定性等性能。